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2OZ Copper Custom Printed Circuit Board 6 Layer PCB Medical 1.6MM thickness

Global Success Circuits Co.,Ltd
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Address: Headquarters :F12, Xingji Building Shangxing Road Shajing Town ,Baoan District Shenzhen China

Contact name:Rose Guo

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Global Success Circuits Co.,Ltd

2OZ Copper Custom Printed Circuit Board 6 Layer PCB Medical 1.6MM thickness

Country/Region china
City & Province shenzhen guangdong
Categories Wiring Harness
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Product Details

2OZ Copper Custom Printed Circuit Board 6 Layer PCB Medical 1.6MM thickness

 

Number of layers: 6 layers
Material: FR4
Board thickness: 1.6mm
Surface plating: Lead Free HASL
Special process description: 2OZ 

Min  Trace: 3mil

 

 

Brief introduction of GS:

1. GS are ISO/TS and UL certified.

2. We have 3 factories and more than 1000 employees in China.

3. With very compitive price and high quality, 50% pcb are exported to Europe and America.

 

GS can help your business stay ahead of the competition by improving quality, productivity, and delivery in your supply chain while reducing costs.

 

Welcome to send inquiry to me for comparing price any time.

 

PCBA/PCB assembly specifications:

  1. PCB layers: 1 to 18 layers (standard)
  2. PCB materials/types: FR4, aluminum, CEM1, super thin PCB, FPC/gold finger, HDI
  3. Assembly service types: DIP/SMT or mixed SMT and DIP
  4. Copper thickness: 0.5-10oz
  5. Assembly surface finish: HASL, ENIG, OSP, immersion tin, immersion Ag, flash gold
  6. PCB dimensions: 450x1500mm
  7. IC pitch (min): 0.2mm
  8. Chip size (min): 0201
  9. Leg distance (min): 0.3mm
  10. BGA sizes: 8x6/55x55mm
  11. SMT efficiency: SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA
  12. u-BGA ball diameter: 0.2mm
  13. Required docs for PCBA Gerber file with BOM list and pick-n-place file (XYRS)
  14. SMT speed: chip components SMT speed 0.3S/pieces, max speed 0.16S/pieces

What can we do for you?

  1. EMS-electronic manufacturing service
  2. PCB supply and layout
  3. PCB assembly on SMT, BGA and DIP
  4. Cost effective components sourcing
  5. Fast turn prototype and mass production
  6. Box build assembly
  7. Engineering supported
  8. Tests (X-ray, 3D paste thickness, ICT, AOI and functional tests)

For PCBA order, provide us:

  1. PCB Gerber file
  2. BOM list for PCBA
  3. Sample of PCB and PCBA
  4. Test method for PCBA

Services and applications:

  1. Through hole board assembly
  2. SMT assembly including BGA assembly, smallest placement: 0201
  3. Material procurement
  4. Consigned material management
  5. Plastic or metal enclosure
  6. Complex final assembly
  7. Functional test
  8. Cable assembly
  9. Labeling and packing
  10. Customized logistics per customer
  11. Laser cut framed SMT solder paste stencils
  12. PCB design and schematic capture

PCBA capabilities:

  1. Component height: 0.2-25mm
  2. Min packing: 0201
  3. Min distance from
  4. BGA: 0.25-2.0mm
  5. Min BGA size: 0.1-0.63mm
  6. Min QFP space: 0.35mm
  7. Min assembly size: 50*30mm
  8. Max assembly size: 350*550mm
  9. Pick-placement precision: 0.01mm
  10. Pick-placement range: QFP, SOP, PLCC, BGA
  11. Placement capability: 0805, 0603, 0402, 0201
  12. High-pin count press fit available
  13. SMT capacity per day: 3,200,000 point

Competitive advantages:

  1. No minimum order quantity and free sample
  2. Focus on low to medium volume production
  3. Quick and on-time delivery
  4. International approvals
  5. Great customer service
  6. Diversified shipping method

 

 

ItemMass productionSmall batch production
Number of layersUP TO 18LUP TO L
Laminate typeFR-4, halogen free, high TG(Shengyi, KB), Cem-3, PTFE, aluminum based, PTEE, Rogers or more.FR-4, Halogen free, High TG(Shengyi, KB), Cem-3, PTFE, Aluminum based, PTEE, Rogers or more.
Maximum board size610mm*1100mm610mm*1100mm
Board thickness0.1mm-7.00mm<0.1mm and >7.00mm
Minimum line width/space3.5mil(0.0875mm)3mil(0.075mm)
Minimum line gap+/-15%+/-10%
Outer layer copper thickness35um-175um35um-210um
Inner layer copper thickness12um-175um12um-210um
Drilling hole size(Mechanical)0.15mm-6.5mm0.15mm-6.5mm
Finished hole size (Mechanical)0.15mm-6.0mm0.15mm-6.0mm
Board thickness hole size ratio14:116:1
Board thickness tolerance(t=0.8mm)±8%±5%
Board thickness tolerance(t<0.8mm)±10%±8%
Min. grid line width4mil(12, 18, 35um), 6mil(70um)4mil(12, 18, 35um), 6mil(70um)
Min. grid spacing6mil(12, 18, 35um), 8mil(70um)6mil(12, 18, 35um), 8mil(70um)
Hole size tolerance(Mechanical)0.05-0.075mm0.05mm
Hole position tolerance(Mechanical)0.005mm0.005mm
Solder mask colorGreen, Blue, Black, White, Yellow, Red, Grey etc.Green, Blue, Black, White, Yellow, Red, Grey etc.
Impedance control tolerance+/-10%+/-8%
Min. distance between drilling to conductor(non-blind buried orifice)8mil(8L), 9mil(10L), 10mil(14L), 12mil(26L)6mil(8L), 7mil(10L), 8mil(14L), 12mil(26L)
Min. Character width and height(35um base copper)Line width: 5mil
Height: 27mil
Line width: 5mil; height: 27mil
Max. test voltage500V500V
Max. test current200mA200mA




Surface treatment
Flash Gold0.025-0.075um0.025-0.5um
Immersion Gold0.05-0.1um0.1-0.2um
Sn/Pb HASL1-70um1-70um
Lead-free HASL1-70um1-70um
Immersion Silver0.08-0.3um0.08-0.3um
OSP0.2-0.4um0.2-0.4um
Gold Finger0.375um>=1.75um
Hard Gold Plating0.375um>=1.75um
Immersion Sin0.8um 
V-Cut rest thickness tolerance±0.1mm±0.1mm








Outline profile
ChamferThe angle type of the chamfer30,45,60
Plug via holeMax.size can be plugged0.6mm
Largest NPTH hole size6.5mm>6.5mm
Largest PTH hole size6.5mm>6.5mm
Min. solder spacer ring0.05mm0.05mm
Min. solder bridge width0.1mm0.1mm
Drilling diameter0.15mm-0.6mm0.15mm-0.6mm
Min. pad diameter with hole14mil( 0.15mm drilling)12mil( 0.1mm laser)
Min. BGA pad diameter10mil8mil
Chemical ENIG gold thickness0.025-0.1um(1-4U)0.025-0.1um
Chemical ENIG nickel thickness3-5um(120-200U)3-5um
Min. resistance testΩ5

 

 
 

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