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1oz FR4 Silkscreen Multilayer PCB Board Blue Solder Mask 1.6MM Thickness

Global Success Circuits Co.,Ltd
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Address: Headquarters :F12, Xingji Building Shangxing Road Shajing Town ,Baoan District Shenzhen China

Contact name:Rose Guo

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Global Success Circuits Co.,Ltd

1oz FR4 Silkscreen Multilayer PCB Board Blue Solder Mask 1.6MM Thickness

Country/Region china
City & Province shenzhen guangdong
Categories Welding Helmets
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Product Details

1oz FR4 Silkscreen Multilayer PCB Board Blue Solder Mask 1.6MM Thickness

 

Global Success is a professional ( Printed Circuit Board ) PCB manufacturer in China. It specializes in manufacturing High Precision, High Density, High Reliability, DS, Multilayer PCB and Special Technics PCB with very competitive price, which are widely applied in computers, industry control, medical instruments, and different types of telecommunications system equipments.

 

 

Production Capacity

 

CB manufacturing capability - ItemProductionPrototype
Max Layer Count2-12 Layers2-14 Layers
Max Board Thickness0.175”0.200”
Max Board Size26"×26")26"×26")
Min Board Thickness0.014”0.012”
Min Track Width/Gap, Outer/Inner (17 micron)0.003” / 0.003”0.003” / 0.003”
Min Hole Size0.006”0.006”
Min Annular Ring (outer layer)0.003”0.003”
Min Annular Ring (inner layer)0.004”0.004”
Drill to Metal0.008”0.007”
Drilling Tolerance(PTH&NPTH)+/- 0.002”+/- 0.002”
Hole Position Tolerance+/- 0.003”+/- 0.002”
Min Solder mask Registration0.001”0.001”
Board Thickness(<1.0mm) Tolerance
+/-0.004"
+/-0.004"
Board Thickness(>1.0mm) Tolerance
+/-10%
+/-10%
Inner Layer Registration+/- 0.004”+/- 0.004”
Outline Routed Tolerance+/- 0.004”+/- 0.004”
Outline Scored Tolerance+/- 0.008”+/- 0.008”
Aspect Ratio</= 8:1</= 12:1
Min QFP Pitch (not HASL)0.016”0.010”
Controlled Impedance(Single ended)
Controlled Impedance( Differential )
50 - 90 ohms +/- 6%
100 - 155 ohms +/- 10%
50 - 90 ohms +/- 7%
100 - 155 ohms +/- 8%
Max Internal Copper Wt.6 oz7 oz
HDI(1+N+1 Max Layer Count)-Min Via Size
- Min Capture Pad Size
0.004”
0.012”
0.004”
0.012”

 

Surface Finish Selection:
Surface finish treatmentProductionPrototype
Liquid Photo-Imageable Solder Mask (LPI)
10-40um
10-40um
Peelable Solder Mask
0.2-0.5mm
0.2-0.5mm
Conductive Carbon Ink
≤20Ω
≤20Ω
Hot Air Solder Leveled Finish (HASL) /HAL Lead Free1-30um1-30um
Organic Solderability Preservatives(OSP)Entek Cu 106A HT , Preflux F2 LX
Thickness 0.2-0.6um
Entek Cu 106A HT, Preflux F2 LX
Thickness 0.2-0.6um
Electroless Immersion GoldNi: 2.0-10um Au: 0.025-0.10umNi: 2.0-10um Au: 0.025-0.10um
Electrolytic Flash GoldNi: 2.5-10um Au: 0.020-0.075umNi: 2.5-10um Au: 0.020-0.075um
Electroless Immersion Silver0.10-0.5um0.10-0.5um
Electroless Immersion Tin0.3-2.0um0.3-2.0um
Gold tab/finger plating(3u"-60u")
Ni: 2.5-10um Au: 0.25-1.50um
Ni: 2.5-10um Au: 0.25-1.50um
Selective Surface Treatment
ENIG+OSP, ENIG+G/F, Flash Gold+HAL, Flash Gold+G/F,Immersion Silver+G/F, Immersion Tin+G/F

 

 

 

Special Materials Selection:
High Performance MaterialsProductionPrototype
Al / Cu SubstrateYesYes
Bismalemide Triazine
(BT) or equivalent
YesYes
Nelco N 4000 - 13YesYes
Nelco N 4000 - 13 (SI)YesYes
Nelco N 4000 - 12
Yes
Yes
Rogers RO4350YesYes
Rogers RO4003YesYes
Rogers RO4233YesYes
Taconic RF-35YesYes
Taconic RF-45YesYes
Taconic TLX-8YesYes
Arlon AD250YesYes
Arlon AD320YesYes
Arlon IsoClad917YesYes
Isola FR408YesYes
Isola 370HRYesYes
Isola 406HRYesYes
Getek / MegtronYesYes
Polyclad PCL-FR370HRYesYes
Hitachi MCL-BE-67GYesYes
Halogen FreeYesYes

 

Other Normal Materials:
Normal MaterialProductionPrototype
Solder Mask MaterialTaiyo or TumuraTaiyo or Tumura
Laminate Material

Shengyi
(S1130,S1141,S1141,S1150,
S1170)

ITEQ (IT140,IT150,IT-140G,ANTI-CAF,IT155G,IT180)

Nanya , Goword (GW40,GW4011

KB (KB-7150CEM,KB-6167,KB-6165,KB-6162,KB-6160/6160C,KB6165/6160)

Shengyi
(S1130,S1141,S1141,S1150,
S1170)

ITEQ (IT140,IT150,IT-140G,ANTI-CAF,IT155G,IT180)

Nanya , Goword (GW40,GW4011

KB (KB-7150CEM,KB-6167,KB-6165,KB-6162,KB-6160/6160C,KB6165/6160)

HASL Lead FreeSN100CSN100C
Peelable MaskSD2955SD2955

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Lead time:

 

PCB manufacturing Lead Time:
Layer CountQuick-turn PrototypeMass Production
2 Layers24 Hours12 Working Days
4 Layers48 Hours13 Working Days
6 Layers72 Hours14 Working Days
8 Layers96 Hours14 Working Days
10 Layers140 Hours16 Working Days
12 Layers160 Hours17 Working Days
14 Layers180 Hours20 Working Days
16-20 LayersSpecified case by case
More than 20 Layers
Specified case by case

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PCB Factory Tour

 

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