Surface Mountable 6V 500mA Low Profile Mini Fuse

TUV Approved Low Profile 1608 Metric POLY-FUSE SMD Surface Mountable PTC Resettable Fuse EIA 0603 6V 500mA

Summary

(a) RoHS Compliant & Halogen Free

(b) Applications: All high-density boards

(c) Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices

(d) Operation Current: 500mA

(e) Maximum Voltage: 6VDC

(f) Temperature Range : -40℃ to 85℃

Agency Recognition

TUV

UL

CSA

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Working Principle

FSMD Series PTC provides surface mount overcurrent protection for applications where space is at a premium and resettable protection is desired.

Electrical Characteristics (23℃)

H=Hold current-maximum current at which the device will not trip at 23℃still air.

IT=Trip current-minimum current at which the device will always trip at 23℃ still air.

V MAX=Maximum voltage device can withstand without damage at it rated current.(I MAX)

I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX).

Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃ still air environment.

RMIN=Minimum device resistance at 23℃ prior to tripping.

R1MAX=Maximum device resistance at 23℃ measured 1 hour after tripping or reflow soldering of 260℃ for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin

Dimension   (Unit:mm)

Material Specification

Terminal pad material: Pure Tin
Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3

Thermal Derating Curve

Typical time to trip at 25℃

The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables.

Thermal Derating Chart – I hold (Amps)