MCP23S08-E/SO Electronic IC Chips 8-Bit I/O Expander with Serial Interface

8-Bit I/O Expander with Serial Interface

Features

• 8-bit remote bidirectional I/O port - I/O pins default to input

• High-speed I2C™ interface (MCP23008)

  - 100 kHz

  - 400 kHz

  - 1.7 MHz

• High-speed SPI interface (MCP23S08)

  - 10 MHz

• Hardware address pins

  - Three for the MCP23008 to allow up to eight devices on the bus

  - Two for the MCP23S08 to allow up to four devices using the same chip-select

• Configurable interrupt output pin

  - Configurable as active-high, active-low or open-drain

• Configurable interrupt source

  - Interrupt-on-change from configured defaults or pin change

• Polarity Inversion register to configure the polarity of the input port data

• External reset input

• Low standby current: 1 µA (max.)

• Operating voltage:

  - 1.8V to 5.5V @ -40°C to +85°C (I-Temp)

  - 2.7V to 5.5V @ -40°C to +85°C (I-Temp)

  - 4.5V to 5.5V @ -40°C to +125°C (E-Temp)

Packages

• 18-pin PDIP (300 mil)

• 18-pin SOIC (300 mil)

• 20-pin SSOP

• 20-pin QFN

Block Diagram

Absolute Maximum Ratings †

Ambient temperature under bias................................................................-40°C to +125°C

Storage temperature ................................................................................ -65°C to +150°C

Voltage on V_DD with respect to V_SS ............................................................ -0.3V to +5.5V

Voltage on all other pins with respect to V_SS (except V_DD)................ -0.6V to (V_DD + 0.6V)

Total power dissipation (Note) ...............................................................................700 mW

Maximum current out of V_SS pin ..............................................................................150 mA

Maximum current into V_DD pin ..................................................................................125 mA

Input clamp current, I_IK (V_I < 0 or V_I > V_DD).............................................................. ±20 mA

Output clamp current, I_OK (V_O < 0 or V_O > V_DD) ...................................................... ±20 mA

Maximum output current sunk by any output pin ..........................................................25 mA

Maximum output current sourced by any output pin .....................................................25 mA

Note: Power dissipation is calculated as follows:

           P_DIS = V_DD x {I_DD - ∑ I_OH} + ∑ {(V_DD-V_OH) x I_OH} + ∑(V_OL x I_OL)

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

Package Types

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