Gold Plating FR-4 6 Layer PCB Assembly Service For HDI Communications Circuit TS16949:2002

Gold Plating FR-4 6 Layer PCB Assembly Service For HDI Communications Circuit TS16949:2002

(1) material:FR4  thickness: 1.6mm

(2) Layer account: 6 layers

(3) solder mask:white

(4) surface: Lead free HAL

(5) size: 1020mm*180mm

(6) place of Original: China

(7) FASTPCBA

(8) model number: HDI PCB 51
 
(9) certification: UL  

(10) MOQ: 10pcs

(11) Price:

(12) Packaging Details: ESD

(13) Delivery Time: 1 week

(14) Payment Terms: T/T in advance

(15) Supply Ability: 20Kpcs/month for food cleaning inspection machine with 8 Channels
 

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Reference- Our production capability for Rigid PCB:

1) layer: 1-22

2) Board finished thickness: 0.2mm-7.0mm

3) Material: FR-4,  CEM-3,  High TG,  FR4 Halogen Free,  Rogers.

4) Max. Finished board size: 580mm*900mm

5) Min hole size: 4mil(0.1mm)

6) Min trace width/space: 3.5mil/3.5mil

7) Surface finishing/treatment: HASL/Lead free HASL,  Immersion Gold,  Gold plating,  Immersion silver,  immersion Tin,  OSP.

8) Copper thickness: 0.5oz to 6oz.

9) Solder mask color: Green/Yellow/Black/White/Red/Blue.

10) Copper thickness in hole: >18um

11) Inner packing: Vacuum packing/plastic bag

12) Outline tolerance:+/-0.13mm

Hole size tolerance: PTH+/-0.076mm NPTH:+/-0.05mm.

13) Quality ensure: UL approval,  TS16949:2002

14) Special requirements: Buried and Blind vias,  impedance control,  via plug,  BGA soldering,  Gold finger.

15) Profiling: punching,  Routing,  V-cut,  Beveling.

16) Provides OEM services to all sorts of printed circuit board assembly as well as Electronic encased products,  and PCBA application from communication,  medical,  security and industrial control.

17) Assembly capacity: 

Min soldering size: 0201

Capacity/day: 700, 000 points