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±20 μm Precision FPC Laser Cutting Machine For PCB Board Manufacturing Process

Shenzhen SMTfly Electronic Equipment Manufactory Limited

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Address: 4 F, Sengang Industrial Park, Yongfu Road, Fuyong Town, Shenzhen

Contact name:Eric Cao

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±20 μm Precision FPC Laser Cutting Machine For PCB Board Manufacturing Process

Country/Region china
City & Province shenzhen chongqing
Categories Manufacturing & Processing Machinery Parts Agents
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Product Details

±20 μm Precision FPC Laser Cutting Machine For PCB Board Manufacturing Process FPC Laser Cutting Machine Parameter

 

Parameter 

 

 

 

 

 

 

 

Technical parameters

Main body of laser1480mm*1360mm*1412 mm
Weight of machine1500Kg
PowerAC220 V
Laser355 nm
Laser

Optowave 10-20W(US)

Material≤1.2 mm
Precision±20 μm
Positioning±2 μm
Platform±2 μm
Working area450*430 mm
Maximum3 KW
VibratingCTI(US)
PowerAC220 V
Diameter20±5 μm
Ambient20±2 ℃
Ambient<60 %
The MachineMarble

 

FPC Laser Cutting Machine Features:

 

1. Neat and smooth edge, no burr or overflow

2. More quick and easy, shorten the delivery time

3. High quality ,no distortion,surface clean& uniformity;

4. Gathering the CNC tech,laser tech,software tech…High accuracy, High speed.

 

FPC Laser Cutting Machine Advantages:

  1. High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries;
  2. Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;
  3. Reduce energy consumption, Cost savings;
  4. Cost-effective, fast cutting speed, stable performance.

FPC Laser Cutting Machine Application:

 

FPC and some relative materials;

  FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.

 

 

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