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14nm Lithography Laptop CPU Processors Celeron N3450 SR2Z64M Cache Up To 2.4 GHz

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14nm Lithography Laptop CPU Processors Celeron N3450 SR2Z64M Cache Up To 2.4 GHz

Country/Region china
Categories CPUs
InquireNow

Product Details

General information
TypeSystem-on-a-Chip
Market segmentMobile
Family
 
Intel Mobile Celeron (Apollo Lake)
Model number ?N3450
SoC part number
  • FH8066802979803 is an OEM/tray SoC
Frequency ?1100 MHz
Maximum turbo frequency2200 MHz (1 core)
2100 MHz (2 or more cores)
Low power frequency800 MHz
Package1296-ball Flip Chip Ball Grid Array (Type 3)
SocketBGA1296
Size1.22" x 0.94" / 3.1cm x 2.4cm
Introduction dateAugust 30, 2016
Price at introduction$107
S-spec numbers
Part numberProduction processors
 SR2YASR2Z6
FH8066802979803++
Architecture / Microarchitecture
MicroarchitectureGoldmont
Processor core ?Apollo Lake
Core steppings ?B0 (SR2YA)
B1 (SR2Z6)
Manufacturing process0.014 micron
Data width64 bit
The number of CPU cores4
The number of threads4
Floating Point UnitIntegrated
Level 1 cache size ?4 x 32 KB 8-way set associative instruction caches
4 x 24 KB 6-way set associative data caches
Level 2 cache size ?2 x 1 MB 16-way set associative shared caches
Level 3 cache sizeNone
Physical memory8 GB
MultiprocessingUniprocessor
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 ?
  • AES / Advanced Encryption Standard instructions
  • SHA / Secure Hash Algorithm extensions
  • EM64T / Extended Memory 64 technology / Intel 64 ?
  • VT-x / Virtualization technology ?
  • VT-d / Virtualization for directed I/O
  • BPT / Burst Performance technology
Security Features
  • NX / XD / Execute disable bit ?
  • MPX / Memory Protection Extensions
  • SMAP / Supervisor Mode Access Prevention
  • SMEP / Secure Mode Execution Protection
Low power features
  • Core CC1 and CC6 states
  • Module MC0 and MC7 states
  • System S0ix, S3, S4 and S4 states
  • Enhanced SpeedStep technology ?
Integrated peripherals / components
Display controller
  • 3 displays
  • MIDI-DSI 1.1 / DP 1.2 / HDMI 1.4b / eDP 1.3
  • DP output supports up to 4096 x 2160 at 60 Hz
  • eDP and HDMI supports up to 3840x2160 at 30 Hz
Integrated graphicsGPU Type: Intel HD 500
Microarchitecture: Gen 9 LP
Execution units: 12
Base frequency (MHz): 200
Maximum frequency (MHz): 700
Memory controllerThe number of controllers: 1
Memory channels: 2
Channel width (bits): 64
Supported memory: DDR3L-1333, DDR3L-1600, DDR3L-1866, LPDDR3-1333, LPDDR3-1600, LPDDR3-1866, LPDDR4-1600, LPDDR4-2133, LPDDR4-2400
Maximum memory bandwidth (GB/s): 38.4
Other peripherals
  • PCI Express 2.0 interface (6 lanes)
  • Image Signal Processor
  • HD Audio
  • eMMC and SD-Card interfaces
  • I2S interface
  • I2C controler
  • SPI interface
  • High-Speed UART
Supported interfaces
  • 6x USB 3.0 ports
  • 2x SATA 3 ports
Electrical / Thermal parameters
Maximum operating temperature ?105°C
Thermal Design Power ?6 Watt

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General information Type System-on-a-Chip Market segment Mobile Family Intel Mobile Celeron (Apollo ...