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[China]
Trade Verify
Address: No.A1507H2 Xinhe Century Building, 3069 Caitian Rd, Gangxia Community, Futian District, Shenzhen City, China
Contact name:Ricky Zou
RULETEAM CONNECTION TECHNOLOGY (SHENZHEN) CO.,LTD |
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Verified Suppliers
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1, The specification of the product including basic size information, electrical and mechanical properties.
| Basic size information | |||
| Suitable housing | A1250H series | ||
| Category | wafer | ||
| Pitch | 1.25mm | ||
| Lock to mating part | with | ||
| Panel mount | yes | ||
| Pin material | phosphor bronze/tin-plated | ||
| Circuits | 2 to 16pins | ||
| Wire insulation diameter | 0.90mm Max. | ||
| Electrical properties | |||
| Current Rating: | 1A AC, DC | ||
| Voltage Rating | 125V AC, DC | ||
| Contact Resistance: | 20mΩ Max | ||
| Insulation Resistance: | 100mΩ min | ||
| Withstanding Voltage: | 500V AC/minute | ||
| Mechanical properties | |||
| Temperature range | -25℃ to 85 ℃ | ||
| Other information please kindly check the following picture. | |||
2, Related drawing and report
Folllowing pictures are out testing report and exact engineering drawing for your information, please kindly check it, wish it can help you to get what you really need.
5. Mechanical Performance
| Test Description | Procedure | Requirement | ||
| 5-1 | Actuator Insertion & Withdrawal Force | Insert and withdraw connectors at the speed rate of 25±3mm / minute. | Refer to paragraph 7 | |
| 5-2 | Crimping Pull Out Force | Fix the crimped terminal, apply axial pull out force on the wire at the speed rat of 25±3mm / minute.(Based upon JIS C5402 6.8) | AWG#28 | 1.0kgf (Min) |
| AWG#30 | 0.8kgf (Min) | |||
| AWG#32 | 0.5kgf (Min) | |||
| 5-3 | Terminal Insertion Force. | Insert the crimped terminal into the housing. | 0.50kgf (Max.) | |
| 5-4 | Terminal/Housing Retention Force. | Apply axial pull out force at the speed rate of 25±3mm / minute on the terminal assembled in the housing. | 0.50kgf (Min.) | |
| 5-5 | Pin Retention Force | Apply axial push force at the speed rate of 25±3mm / minute | 0.50kgf (Min.) | |
| 5-6 | Durability | When mated up to 50 cycles repeatedly by the rate of 10 cycle per minute. | Contact Resistance 40mΩ (Max.) | |
| 5-7 | Vibration | Amplitude: 1.5mm P-P Sweep time: 10-55-10 Hz in 1 minute Duration: 2 hours in each X.Y.Z. axes. (Based upon MIL-STD-202 Method 201A) | Appearance No Damage. Contact Resistance 40mΩ (Max.) Discontinuity 1 μsec.(Max.) | |
| 5-8 | Physical Shock | 490m/s²｛50G｝,3 strokes in each X.Y.Z. axes. (Based upon JIS C0041/MIL-STD-202 Method 213B Cond. A) | ||
6. Environmental Performance And Others
| Test Description | Procedure | Requirement | |
| 6-1 | Temperature Rise | Carrying rated current load.(Based upon UL 498) | 30℃(Max.) |
| 6-2 | Heat Resistance | 85±2℃,96 hours (Based upon JIS C0021/MIL-STD-202 Method 108A Cond. A) | Appearance No Damage. Contact Resistance 40mΩ (Max.) |
| 6-3 | Cold Resistance | -25±3℃,96 hours (Based upon JIS C0020) | |
| 6-4 | Humidity | Temperature: 40±2℃ Relative Humidity : 90~95% Duration: 96 hours (Based upon JIS C0022/MIL-STD-202 Method 103B Cond. B) | Appearance No Damage. Contact Resistance 40mΩ (Max.) Insulation Resistance 10MΩ (Min.) Dielectric Withstanding Voltage Must meet 4-3 |
| 6-5 | Temperature Cycling | 5 cycles of: a) -55℃ 30 minutes b) +85℃ 30 minutes (Based upon JIS C0025) | Appearance No Damage. Contact Resistance 40mΩ (Max.) |
| 6-6 | Salt Spray | Tin-plated 16 hours / Gold- plated 24 hours exposure to a salt spray from the 5±1% solution at 35±2℃. (Based upon JIS C0023/MIL-STD-202 Method 101C Cond. B) | |
| 6-7 | SO2 Gas | 24 hours exposure to 50±5ppm. SO2 gas at 40±2℃. | |
| 6-8 | NH3 Gas | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution. | |
| 6-9 | Solderability | Soldering Time: 5±0.5 sec. Solder Temperature: 245±5℃ | Solder Wetting 95% of immersed area must show no voids, pin holes |
| 6-10 | Resistance to Soldering Heat (DIP) | Solder pot method Soldering time: 10±0.5 sec. Solder Temperature: 260±5℃ Solder iron method Soldering Time: 5±0.5 sec. Solder Temperature: 370℃ ~ 400℃ | Appearance No Damage. |
| 6-11 | Resistance to Soldering Heat (SMT) | When reflowing Refer to paragraph 8 Solder iron method Soldering Time: 5±0.5 sec. Solder Temperature: 370℃ ~ 400℃ | Appearance No Damage. |
3, Application fied of these product
This product is developed for PDP, LCD, or small electronics equipment.It is with strong structure against external force. Because all of our product have very high quality, it is accepted by famouse manufacturer like Huawei, Skyworth, BYD etc. And the all are certificated by REACH, UL, RoHs. In order to protect the evironment, some parts are halogen free.
