Active Member
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[China]
Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Contact name:Sally Mao
Shenzhen Bicheng Electronics Technology Co., Ltd |
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Taconic RF-35 High Frequency Printed Circuit Board DK 3.5 RF PCB
10mil 20mil 30mil 60mil
(Printed Circuit Boards are custom-made products, the picture and
parameters shown are just for reference)
RF-35 is an organic-ceramic laminate material in the ORCER (Organic
Ceramic) family of Taconic products. It is based on woven glass
reinforcement. RF-35 is the result of Taconic's expertise in both
ceramic filling technology and coated polytetrafluoride (PTFE)
fiberglass.
RF-35 is the best choice for low cost, high volume commercial
microwave and radio frequency applications.It has an excellent peel
strength for 1/2 ounce and 1 ounce copper (even compared to
standard epoxy glass), a key aspect of the need for rework.
RF-35's Tg exceeds 315 ℃. Its ultra low moisture absorption rate
and low dissipation factor minimize phase shift with frequency.
RF-35 used woven fabrics in the design result in the stable
dimension. The laminates are usually orderly clad on one side or
both sides with 1/2,1 and 2 ounces electrodeposited copper
respectively.
So we benefit from its low cost, excellent peel strength,
exceptionally low dissipation factor, low moisture absorption and
enhanced surface smoothness.
Applications
Power Amplifiers
Filters and Couplers
Passive Components
Our PCB Capability (RF-35)
| PCB Material: | PTFE Ceramic Fiberglass |
| Designation: | RF-35 |
| Dielectric constant: | 3.5 |
| Dissipation Factor | 0.0018 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc.. |
RF-35 Typical Value
| Property | Test Method | Unit | Value | Unit | Value |
| Dielectric Constant @ 1.9 GHz | IPC-TM 650 2.5.5 | 3.5 | 3.5 | ||
| Dissipation Factor @ 1.9 GHz | IPC-TM 650 2.5.5 | 0.0018 | 0.0018 | ||
| Moisture Absorption (.060") | IPC-TM 650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Peel Strength (1/2 oz. copper) | IPC-TM 650 2.4.8 | lbs./linear inch | >8.0 | N/mm | >1.5 |
| Peel Strength (1 oz. copper) | IPC-TM 650 2.4.8 | lbs./linear inch | >10.0 | N/mm | >1.8 |
| Dielectric Breakdown | IPC-TM 650 2.5.6 | kV | 41 | kV | 41 |
| Volume Resistivity | IPC-TM 650 2.5.17.1 | Mohm/cm | 1.26 x 109 | Mohm/cm | 1.26 x 109 |
| Surface Resistivity | IPC-TM 650 2.5.17.1 | Mohm | 1.46 x 108 | Mohm | 1.46 x 108 |
| Arc Resistance | IPC TM 650 2.5.1 | seconds | >180 | seconds | >180 |
| Flexural Strength Lengthwise | ASTM D 790 | psi | >22,000 | N/mm2 | >152 |
| Flexural Strength Crosswise | ASTM D 790 | psi | >18,000 | N/mm2 | >124 |
| Thermal Conductivity | ASTM F 433 | W/m/K | 0.24 | W/m/K | 0.24 |
| Tensile Strength Lengthwise | ASTM D 638 | psi | 27,000 | N/mm2 | 187 |
| Tensile Strength Crosswise | ASTM D 638 | psi | 21,000 | N/mm2 | 145 |
| Dimensional Stability Lengthwise | IPC-TM 650 2.4.39 | in/in | 0.00004 | mm/mm | 0.00004 |
| Dimensional Stability Crosswise | IPC-TM 650 2.4.39 | in/in | -0.0001 | mm/mm | -0.0001 |
| x-y CTE | ASTM D 3386 (TMA) | ppm/°C | 19-24 | ppm/°C | 19-24 |
| z CTE | ASTM D 3386 (TMA) | ppm/°C | 64 | ppm/°C | 64 |
| Flammability | UL-94 | V-0 | V-0 | ||
| Hardness | Rockwell M Scale | 34 | 34 |
| Type | Dk | |
| TLY-5A | 2.17 | |
| TLY-5 | 2.20 | |
| TLY-3 | 2.33 | |
| TLT-0 | TLX-0 | 2.45 |
| TLT-9 | TLX-9 | 2.50 |
| TLT-8 | TLX-8 | 2.55 |
| TLT-7 | TLX-7 | 2.60 |
| TLT-6 | TLX-6 | 2.65 |
| TLE-95 | 2.95 | |
| TLC-27 | 2.75 | |
| TLC-30 | 3.00 | |
| TLC-32 | 3.20 | |
| RF-30 | 3.00 | |
| RF-35 | RF-35P | 3.50 |
| RF-60 | 6.15 | |
| CER-10 | 10 | |
