Active Member
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[China]
Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Contact name:Sally Mao
Shenzhen Bicheng Electronics Technology Co., Ltd |
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Rogers RO4730G3 60mil 1.524mm High Frequency PCB Cellular Base Station Antenna PCB
Rogers RO4730G3 antenna grade laminates are reliable, low-cost
alternative to the conventional PTFE-based laminates. It has the
mechanical and electrical properties that antenna designers need.
The materials have a dielectric constant of 3.0 and a loss tangent
of 0.0022 measured at 2.5 GHz when using LoPro Reverse Treated EDC
foil. These values allow antenna designers to realize substantial
gain values while minimizing signal loss. Materials are available
with demonstrated low PIM performance, with values better than
-160dBc.
RO4730G3 materials are compatible with conventional epoxy and high
temperature lead-free solder processing. It does not require the
special treatment needed on traditional PTFE-based laminates for
plated through holes preparation. Multi-layer can be achieved using
RO4450F bondply at 175 ℃. The resin systems of RO4730G3 are
designed to provide the properties sought after by antenna
designers. The glass transition temperature exceeds 280oC, leading
to a low Z-axis CTE, excellent plated through holes reliability,
and lead free solder processability.
Typical application is cellular base station antennas.
General description
This is a type of double sided RF PCB built on 1.524mm (60mil)
RO4730G3 for the application of Cellular Base Station Antenna PCB.
Basic specifications
Base material: RO4730G3 60mil (1.524mm)
Dielectric constant: 3.0+/-0.05
Layer count: 2 layers
Type: Through holes
Format: 110mm x 95mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 μm
Solder mask | Legend: Green | White
Final PCB height: 1.6 mm
Standard: IPC 6012 Class 2
Packing: 20 pieces are packed for shipment.
Lead time: 7 working days
Shelf life: 6 months
| RO4730G3 Typical Value | |||||
| Property | RO4730G3 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.0±0.5 | Z | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 | |
| Dielectric Constant,εDesign | 2.98 | Z | 1.7 GHz to 5 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0028 | Z | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 | |
| 2.5 GHz | |||||
| Thermal Coefficient of ε | +34 | Z | ppm/℃ | -50 ℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | <0.4 | X, Y | mm/m | after etech +E2/150 ℃ | IPC-TM-650 2.4.39A |
| Volume Resistivity (0.030") | 9 X 107 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity (0.030") | 7.2 X 105 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| PIM | -165 | dBc | 50 ohm 0.060" | 43 dBm 1900 MHz | |
| Electrical Strength (0.030") | 730 | Z | V/mil | IPC-TM-650 2.5.6.2 | |
| Flexural Strength MD | 181 (26.3) | Mpa (kpsi) | RT | ASTM D790 | |
| CMD | 139 (20.2) | ||||
| Moisure Absorption | 0.093 | - | % | 48/50 | IPC-TM-650 2.6.2.1 ASTM D570 |
| Thermal Conductivity | 0.45 | Z | W/mK | 50℃ | ASTM D5470 |
| Coefficient of Thermal Expansion | 15.9 14.4 35.2 | X Y Z | ppm/℃ | -50 ℃to 288℃ | IPC-TM-650 2.4.4.1 |
| Tg | >280 | ℃ | IPC-TM-650 2.4.24 | ||
| Td | 411 | ℃ | ASTM D3850 | ||
| Density | 1.58 | gm/cm3 | ASTM D792 | ||
| Copper Peel Stength | 4.1 | pli | 1oz,LoPro EDC | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
