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Hybrid PCB Built On 8mil 0.203mm RO4003C and 0.2mm FR-4 Multilayer High Frequency PCB Combined RO4003C and FR-4

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Shenzhen Bicheng Electronics Technology Co., Ltd

Hybrid PCB Built On 8mil 0.203mm RO4003C and 0.2mm FR-4 Multilayer High Frequency PCB Combined RO4003C and FR-4

Country/Region china
City & Province shenzhen guangdong
Categories Electronics Production Machinery
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Product Details

Hybrid PCB Built On 8mil 0.203mm RO4003C and 0.2mm FR-4 Multilayer High Frequency PCB Combined RO4003C and FR-4

(PCB’s are custom-made products, the picture and parameters shown are just for reference)

 

Hello everyone,

Warm greetings!

 

Today we’ll talk about a type of 4-layer hybrid PCB built on 8mil (0.203mm) RO4003C and FR-4 for the application of attenuator. It's 1.1 mm thick with blue solder mask and immersion silver on pads, 1oz copper on each layer. Generally speaking, this is a type of simple multilayer PCB with hybrid structure. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each board is 100% electrical tested before delivery, 25 boards are packed for shipment.

 

Let’s see the stack-up.

 

 

Layer 1 to layer 2 is the RO4003C core (8mil),the core has fixed thickness which is very important to the electrical length of RF lines on the circuit board, then the left materials are FR-4. Boards are all through holes.

 

Following drawing is the micro-section.

 

 

Features and Benefits

1) RO4003C exhibit a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications;

2) Signal integrity performance improvement over the stack-ups with all FR4 build-up;

3) ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;

4) Thermal stress test, reliability test, insulation resistance test and ionic contamination test, AOI test etc.

5) No MOQ required;

6) More than 19+ years of high frequency PCB experience;

7) 16000㎡ workshop; 30000㎡ output capability per month and 8000 types of PCB's per month;

8) Powerful PCB capabilities support your research and development, sales and marketing;

 

Applications

RF transceiver

Power divider

LNB Attenuator

Directional coupler

Photocoupler

 

Parameter and Data Sheet

PCB SIZE140 x 35 mm=1PCS
BOARD TYPEMultilayer PCB
Number of Layers4 layers
Surface Mount ComponentsYES
Through Hole ComponentsYES
LAYER STACKUPcopper ------- 35um TOP layer
RO4003C 0.203mm
copper ------- 35um(1oz) MidLayer 1
FR-4 0.5mm
copper ------- 35um(1oz) MidLayer 2
FR-4 0.2mm
copper ------- 35um BOT layer
TECHNOLOGY 
Minimum Trace and Space:7.8 mil / 4.4 mil
Minimum / Maximum Holes:0.3 mm / 2.5 mm
Number of Different Holes:4
Number of Drill Holes:91
Number of Milled Slots:0
Number of Internal Cutouts:0
Impedance Control:no
Number of Gold finger:0
BOARD MATERIAL 
Glass Epoxy:Rogers RO4003C +FR4 hybrid material
Final foil external:1 oz
Final foil internal:1 oz
Final height of PCB:1.1 mm ±0.11
PLATING AND COATING 
Surface FinishImmersion silver
Solder Mask Apply To:TOP and Bottom, 12micron Minimum
Solder Mask Color:Blue, KSM-6189BL04/KSM-19H01
Solder Mask Type:LPSM
CONTOUR/CUTTINGRouting
MARKING 
Side of Component LegendNO
Colour of Component LegendNO
Manufacturer Name or Logo:NO
VIAPlated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE 
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

 

 

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