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[China]
Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Contact name:Sally Mao
Shenzhen Bicheng Electronics Technology Co., Ltd |
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High Frequency Hybrid PCB 6-Layer Mixed PCB On 20mil 0.508mm RO4350B and FR-4 with Blind Via
(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)
Hello everyone,
Good day!
Today’s topic is 6-layer hybrid PCB on 20mil RO4350B and FR-4. We’ll see 2 boards in the article.
The first board is used in satellite receiver. There’s one RO4350B core on top layer. See the stack-up below. The structure is a little bit complex due to 3 types of blind vias. It's 1.71 mm thick, white silkscreen over green solder mask on both sides and immersion gold is plated on pads and tracks. Entire board is supplied 1 board up. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.
Following enlarged picture is viewed from side.
The second one is used in signal booster. It used two cores of 20mil RO4350B on top side and bottom side. See the stack-up below.
The specifications are as follows:
Base material: RO4350B 20mil + FR4
Layer count: 6 layers
Type: Blind via L1-L2, L5-L6
Format: 100mm x 120mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 μm| Inner layer 35 μm
Solder mask | Legend: Green | White
Final PCB height: 1.8 mm
Standard: IPC 6012 Class 2
Packing: 20 panels are packed for shipment.
Lead time: 20 working days
Shelf life: 6 months
The applications of RO4350B hybrid PCB are wide. For example, LNA, radar data acquisition converter, spread spectrum, 4G antenna, transmitter, radar data acquisition converter, RF switches and splitter module etc.
The advantages of RO4350B hybrid PCBs are listed as below,
1) RO4350B exhibits a stable dielectric constant over a broad frequency range;
2) Signal integrity performance improved over the stack-ups with all FR4 board;
3) Cost reduced over stack-ups with all low loss material;
4) Strong PCB capability with 8000 types of PCB per month;
5) Qualified ISO9001, ISO14001, IATF16949 and UL certified manufacturing factory;
6) No MOQ, low cost for prototypes and small runs quantity;
Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.
| Parameter | Value |
| Layer Counts | 1-32 |
| Substrate Material | RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc. |
| Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
| Board Outline Tolerance | ±0.0059" (0.15mm) |
| PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) | ±8% |
| Thickness Tolerance(t＜0.8mm) | ±10% |
| Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
| Minimum Track | 0.003" (0.075mm) |
| Minimum Space | 0.003" (0.075mm) |
| Outer Copper Thickness | 35µm--420µm (1oz-12oz) |
| Inner Copper Thickness | 17µm--350µm (0.5oz - 10oz) |
| Drill Hole(Mechanical) | 0.0059" - 0.25" (0.15mm--6.35mm) |
| Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
| Registration (Mechanical) | 0.00197" (0.05mm) |
| Aspect Ratio | 12:1 |
| Solder Mask Type | LPI |
| Min Soldermask Bridge | 0.00315" (0.08mm) |
| Min Soldermask Clearance | 0.00197" (0.05mm) |
| Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
| Impedance Control Tolerance | ±10% |
| Surface Finish | HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger |
