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Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask

Shenzhen Bicheng Electronics Technology Co., Ltd
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Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China

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Shenzhen Bicheng Electronics Technology Co., Ltd

Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask

Country/Region china
City & Province shenzhen guangdong
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Product Details

Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Taconic’s RF-35A2 substrate is designed to have ultra-low fiberglass content to achieve "best in class" insertion loss properties and the uniform dielectric constant 3.5 +/-0.05 throughout the laminate. It is a type of ultra low loss power amplifier material.

 

The uniform dispersion of ceramics throughout the laminate yields an extremely low X and Y thermal expansion coefficient. Low modulus and low X-Y CTE values make RF-35A2 an attractive material for chip carrier in surface mounting technology.

 

RF-35A2 is manufactured with a proprietary multi-step process with excellent dielectric performance and excellent copper peel adhesion.The low 0.0015 dissipation factor at 10 GHz allows for maximum power transfer resulting in low heat generation.

 

 

Benefits:

Low loss properties

DK tolerance of +/- 0.05

Homogeneous DK

Excellent peel strength

Low moisture absorption

 

Our PCB Capability (RF-35A2)

PCB Material:PTFE Ceramic Fiberglass
Designation:RF-35A2
Dielectric constant:3.15
Dissipation Factor0.0015
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm)
PCB thickness:10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc..

 

Applications:

Power amplifiers

Filters / couplers

High speed digital

Passive components

Wireless antennas

 

RF-35A2 Typical Values

PropertyTest MethodUnitValueUnitValue
Dk @ 10 GHzIPC-650 2.5.5.5.1 (Modified) 3.5 3.5
Df @ 10 GHzIPC-650 2.5.5.5.1 (Modified) 0.0015 0.0015
Moisture AbsorptionIPC-650 2.6.2.1%0.03%0.03
Dielectric BreakdownIPC-650 2.5.6/ASTM D 149kV59kV59
Dielectric StrengthASTM D 149V/mil1000V/mm39,370
Volume ResistivityIPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.)Mohm/cm10^9Mohm/cm10^9
Surface ResistivityIPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.)Mohm10^8Mohm10^8
Arc ResistanceIPC-650 2.5.1Seconds242Seconds242
Flexural Strength (MD)IPC-650 2.4.4kpsi24N/mm2165
Flexural Strength (CD)IPC-650 2.4.4kpsi15N/mm2103
Tensile Strength (MD)ASTM D 3039psi16,800N/mm2116
Tensile Strength (CD)ASTM D 3039psi11,000N/mm275.8
Young’s Modulus (MD)ASTM D 3039psi106N/mm28,343
Young’s Modulus (CD)ASTM D 3039psi106N/mm27,171
Poisson’s Ratio (MD)ASTM D 3039 0.14 0.14
Poisson’s Ratio (CD)ASTM D 3039 0.1 0.1
Strain at Break (MD)ASTM D 3039%1.6%1.6
Strain at Break (CD)ASTM D 3039%1.4%1.4
Compressive Modulus (Z axis)ASTM D 695 (23°C)kpsi385N/mm22,650
Peel Strength (1 oz. VLP)IPC-650 2.4.8 (Thermal Stress)lbs/in12N/mm2.1
Peel Strength (1 oz. VLP)IPC-650 2.4.8.3 (150°C ) (Elevated Temp.)lbs/in14N/mm2.5
Peel Strength (1 oz. VLP)IPC-650 2.4.8 Sec. 5.2.3 (Proc. Chemicals)lbs/in11N/mm2
Density (Specific Gravity) gm/cm32.28gm/cm32.28
Specific HeatASTM E 1269 (DSC) (100°C)J/g/K0.99J/g/K0.99
Thermal ConductivityASTM F 433W/M*K0.29W/M*K0.29
TdIPC-650 2.4.24.6 2% Weight Loss°C528°C528
TdIPC-650 2.4.24.6 5% Weight Loss°C547°C547
CTE (x)IPC-650 2.4.41 (>RT - 125°C)ppm/°C10ppm/°C10
CTE (y)IPC-650 2.4.41 (>RT - 125°C)ppm/°C13ppm/°C13
CTE (z)IPC-650 2.4.41 (>RT - 125°C)ppm/°C108ppm/°C108

 

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