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Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4

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Shenzhen Bicheng Electronics Technology Co., Ltd

Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4

Country/Region china
City & Province shenzhen guangdong
Categories Other Wires, Cables & Cable Assemblies
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Product Details

 

Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4

(PCB’s are custom-made products, the picture and parameters shown are just for reference)

 

Hello everyone,

Warm greetings!

 

Today we talk about 4-layer hybrid PCB built on 20mil RO4003C and FR-4.

 

Firstly, it's a 4 layer structure. Layer 1 to layer 2 is 20mil RO4003C core, which is the main wiring layer for the signal lines. Layer 3 to layer 4 is the core of FR-4, both cores are combined through 0.2mm prepeg. Each layer is connected by plated through holes. The inner layer and out layer of copper is 1 ounce. This is a good method to keep the board cost effective.

 

Let's take a look at its micro-section chart.

Here on the left is the PTH hole, the bottom is layer 1 to layer 2 which is high frequency material, the upper part is glass fiber material. The finished thickness of the plate is 1.6mm.

The color of solder mask and silkscreen are also commonly used in green and white. Surface finish on pads is immersion gold.

 

Following is another type of 20mil RO4003C hybrid PCB. It’s made of 2 cores of 20mil RO4003C.

 

The applications of 20mil RO4003C hybrid PCB is wide, such as LNA, optical coupler, balanced amplifier, duplexer etc.

 

The advantages of 20mil RO4003C hybrid PCB are reflected in following 3 points:

1) RO4003C exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications.

2) Reducing signal loss in high frequency application meets the development needs of communication technology.

3) Cost reduced over stack-ups with all low loss material;

 

Our PCB Capability (Hybrid Design)

 

At present, the mature mixed pressing materials are as follows:

RO4350B + FR4;

RO4003C + FR4;

F4B + FR4;

RT/duroid5880 + FR4

RT/duroid5880 + RO4350B

 

Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.

 

Appendix: Data Sheet of RO4003C

 

PropertyRO4003CDirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.38±0.05Z 10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.55Z 8 to 40 GHzDifferential Phase Length Method
Dissipation Factortan,δ0.0027
0.0021
Z 10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε+40Zppm/℃-50℃to 150℃IPC-TM-650 2.5.5.5
Volume Resistivity1.7 x 1010 MΩ.cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity4.2 x 109 COND AIPC-TM-650 2.5.17.1
Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
Tensile Modulus19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi)RTASTM D 638
Tensile Strength139(20.2)
100(14.5)
X
Y
MPa(ksi)RTASTM D 638
Flexural Strength276
(40)
 MPa
(kpsi)
 IPC-TM-650 2.4.4
Dimensional Stability<0.3X,Ymm/m
(mil/inch)
after etch+E2/150℃IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion11
14
46
X
Y
Z
ppm/℃-55℃to288℃IPC-TM-650 2.4.41
Tg>280 ℃ TMAAIPC-TM-650 2.4.24.3
Td425 ℃ TGA ASTM D 3850
Thermal Conductivity0.71 W/M/oK80℃ASTM C518
Moisture Absorption0.06 %48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density1.79 gm/cm323℃ASTM D 792
Copper Peel Stength1.05
(6.0)
 N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
FlammabilityN/A   UL 94
Lead-free Process CompatibleYes    

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