Shenzhen Bicheng Electronics Technology Co., Ltd |
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In the fast-paced world of advanced electronics, innovation is the key to progress. Hybrid printed circuit boards (PCBs) have emerged as game-changers, revolutionizing traditional board designs by integrating multiple materials into a single circuit board. By leveraging the unique properties of substrates like FR-4, ceramic, flex, or metal core laminates, hybrid PCBs offer unmatched flexibility, enhanced performance, and a wide range of applications. In this article, we delve into the world of hybrid PCBs, focusing on the exceptional features and capabilities of RO4003C and RO4350B substrates.
Exploring Hybrid PCBs:
Hybrid PCBs, also known as mixed construction PCBs, redefine
traditional board designs by combining different materials. By
carefully selecting and integrating various substrates based on
their characteristics, such as thermal management, signal
integrity, and mechanical strength, engineers can achieve optimal
performance for specific requirements.
Highlighting the Performance of RO4003C:
RO4003C is an outstanding substrate with exceptional
characteristics that contribute to its high performance. With a
dielectric constant (Dk) of 3.38 +/- 0.05 and a dissipation factor
of 0.0027 at 10GHz, it ensures excellent high-frequency
performance. RO4003C also offers thermal stability with a thermal
coefficient of Dk of 40 ppm/°K and efficient heat dissipation with
a thermal conductivity of 0.71W/mk. Its high glass transition
temperature (Tg > 280°C TMA) ensures durability.
Empowering Reliability with RO4350B:
RO4350B is another impressive substrate that guarantees reliability
in demanding applications. It has a dielectric constant (Dk) of
3.48 +/- 0.05 and a dissipation factor of 0.0037 at 10GHz, ensuring
reliable signal transmission. RO4350B provides stability across
temperature variations with a thermal coefficient of Dk of 50
ppm/°K and a coefficient of thermal expansion matched to copper. It
exhibits remarkable thermal resistance with a decomposition
temperature (Td) of 390°C TGA.
Introducing the PCB Stackup:
Our meticulously designed 6-layer rigid PCB stackup showcases the
full potential of hybrid constructions. By combining copper layers,
RO4003C and RO4350B cores, and RO4450F prepregs, this stackup
ensures optimal signal integrity, mechanical strength, and thermal
management. The strategic selection and arrangement of materials
lay the foundation for diverse applications with superior
performance.
Detailed PCB Construction:
Our hybrid PCBs have a finished board thickness of 1.6mm, striking
a balance between durability and performance. The outer layers
feature a 1oz (1.4 mils) copper weight, providing robustness. The
boards have a minimum trace/space of 6/6 mils, enabling precise
routing. With a minimum hole size of 0.4mm, they accommodate
various component requirements. The boards offer reliable
connectivity with a via plating thickness of 20 μm. Rigorous
testing, including a 100% electrical test, ensures the quality and
reliability of the boards.
Versatility for Various Applications:
Hybrid PCBs find applications in industries such as cellular base
station antennas, automotive radar and sensors, RF identification
tags, and direct broadcast satellite LNBs. Their ability to
optimize performance for specific applications makes them
indispensable for engineers pushing the boundaries of technology
and innovation.
Superior Quality Standard and Global Availability:
Our hybrid PCBs adhere to the IPC-Class-2 quality standard,
ensuring reliability and consistency. With global availability, we
cater to customers worldwide, providing tailored hybrid PCB
solutions to meet their specific requirements.
Conclusion:
Hybrid PCBs represent a significant advancement in advanced
electronics. By harnessing the exceptional performance and
versatility of RO4003C and RO4350B substrates, these PCBs unlock
new possibilities for engineers to create groundbreaking designs.
Embrace the power of hybrid PCBs and unlock the full potential of
your next electronic masterpiece.
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