Shenzhen Bicheng Electronics Technology Co., Ltd |
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Introduction:
Today, we embark on a journey to explore a standout member of the
Rogers RO3000 series - the RO3210 high frequency PCB material. What
sets this material apart is its remarkable mechanical stability,
making it the star of our discussion. Join us as we delve into the
distinctive features and properties of RO3210, a cost-effective
solution that delivers unrivaled electrical performance alongside
enhanced mechanical stability.
An Overview of RO3210 Material Data Sheet:
Let's begin our exploration by delving into the data sheet of
RO3210, which paints a vivid picture of its fundamental properties:
Dielectric Constant and Dissipation Factor:
RO3210 boasts an impressive dielectric constant (DK) of 10.2 and a
low dissipation factor of 0.0027 at 10 GHz and 23 ℃. These tightly
controlled tolerances ensure optimal signal transmission and
minimal signal loss, elevating its RF performance.
Thermal Coefficient of Dielectric Constant (TCDk):
Regrettably, RO3210 exhibits a less favorable temperature stability
with a TCDk value of -459 ppm/℃. As a result, it may not be the
ideal choice for applications exposed to significant temperature
variations, such as automotive electronics or 5G base stations.
Volume Resistivity and Surface Resistivity:
RO3210 shines in terms of volume resistivity and surface
resistivity, falling within the range of most printed circuit board
materials. These impressive properties contribute to reliable
electrical performance, ensuring a dependable foundation for your
circuits.
Moisture Absorption:
With a moisture absorption rate of less than 0.1%, RO3210 triumphs
in resisting moisture-induced changes in dielectric constant and
dissipation factor. This remarkable attribute guarantees consistent
RF performance across diverse environmental conditions, promoting
stability and reliability.
Thermal Conductivity and Specific Heat:
RO3210 exhibits an acceptable thermal conductivity of 0.81 W/mK and
a specific heat value of 0.79 J/g/K. While not groundbreaking,
these characteristics provide adequate thermal attributes for a
wide range of applications.
Coefficient of Thermal Expansion (CTE):
RO3210 showcases a low in-plane CTE of 13 ppm/°C in the X and Y
directions, akin to that of copper. This compatibility makes it a
favorable choice for epoxy multi-layer board hybrid designs,
facilitating reliable surface-mounted assemblies that stand the
test of time.
Decomposition Temperature and Density:
With a decomposition temperature surpassing 500 °C and a density of
3 g/cm³, RO3210 exemplifies resilience and stability in demanding
operational scenarios, ensuring longevity and durability for your
electronic assemblies.
Flammability and Environmental Compliance:
RO3210 meets UL-94V0 flammability standards, guaranteeing its
safety in applications where fire resistance is paramount.
Additionally, it embraces a lead-free and environmentally friendly
composition, aligning with sustainable manufacturing practices that
prioritize our planet's well-being.
Conclusion:
RO3210 high frequency PCB material emerges as an exceptional
choice, combining enhanced mechanical stability, reliable
electrical performance, and adherence to industry standards.
Although its temperature stability may restrict its application in
specific contexts, RO3210 remains unparalleled for a wide spectrum
of RF circuit designs. By harnessing the extraordinary properties
of RO3210, engineers can achieve optimal performance and longevity
in their electronic assemblies, propelling innovation forward while
maintaining steadfast reliability.
Property | Typical Value RO3210 | Direction | Unit | Condition | Test Method |
Dielectric Constant, er Process | 10.2± 0.50 | Z | - | 10 GHz 23°C | IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant, er Design | 10.8 | Z | - | 8 GHz - 40 GHz | Differential Phase Length Method |
Dissipation Factor, tan d | 0.0027 | Z | - | 10 GHz 23°C | IPC-TM-650 2.5.5.5 |
Thermal Coefficient of er | -459 | Z | ppm/°C | 10 GHz 0-100°C | IPC-TM-650 2.5.5.5 |
Dimensional Stability | 0.8 | X,Y | mm/m | COND A | ASTM D257 |
Volume Resistivity | 103 | MW•cm | COND A | IPC 2.5.17.1 | |
Surface Resistivity | 103 | MW | COND A | IPC 2.5.17.1 | |
Tensile Modulus | 579 517 | MD CMD | kpsi | 23°C | ASTM D638 |
Water Absorption | <0.1 | - | % | D24/23 | IPC-TM-650 2.6.2.1 |
Specific Heat | 0.79 | J/g/K | Calculated | ||
Thermal Conductivity | 0.81 | - | W/m/K | 80°C | ASTM C518 |
Coefficient of Thermal Expansion (-55 to 288 °C) | 13 34 | X,Y Z | ppm/°C | 23°C/50% RH | IPC-TM-650 2.4.41 |
Td | 500 | °C | TGA | ASTM D3850 | |
Density | 3.0 | gm/cm3 | |||
Color | Off White | ||||
Flammability | V-0 | UL 94 | |||
Lead Free Process Compatible | YES |