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Flexible Printed Circuit (FPC) Built on Polyimide with Immersion Gold and Stiffener for Connection Strip #FPC Manufactur

Shenzhen Bicheng Electronics Technology Co., Ltd
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Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China

Contact name:Sally Mao

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Shenzhen Bicheng Electronics Technology Co., Ltd

Flexible Printed Circuit (FPC) Built on Polyimide with Immersion Gold and Stiffener for Connection Strip #FPC Manufactur

Country/Region china
City & Province shenzhen guangdong
Categories Plastic Rods
InquireNow

Product Details

 

(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)

 

Specifications

PCB SIZE75 x 26mm=1PCS
Base Material:Polyimide
Number of LayersDouble sided PCB
SMTYES
Through Hole Componentsno
LAYER STACKUPCopper ------- 35um(1oz)
Adhesive
Polyimide
Adhesive
Copper ------- 35um(1oz)
Minimum Trace and Space:4mil/4mil
Minimum / Maximum Holes:0.3mm/ 0.3mm
Final foil external:1oz
Final foil internal:0oz
Final height of PCB:0.15mm ±0.05
Surface Finishimmersion gold
Solder Mask Apply To:TOP, Bottom
Solder Mask Color:Yellow Coverlay
CONTOUR/CUTTINGPunching
Stiffener:FR-4 on back of Gold finger area
Side of Component LegendNO
Colour of Component LegendNO
VIAPlated Through Hole(PTH)
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

 

 

FPC Capabilities 2021

No.SpecificationsCapabilities
1Board TypeSingle layer, Doulbe layer, Multilayer, Rigid-Flex
2Base MaterialPI, PET
3Copper Weight0.5oz, 1oz, 2oz
4LED Maximum Size250 x 5000mm
5General Maximum Size250 x 2000mm
6Board Thickness0.03mm-3.0mm
7Thickness Tolerance±0.03mm
8Mininum Drill Hole0.05mm
9Maximum Drill Hole6.5mm
10Tolerance of Drill Hole±0.025mm
11Thickness of Hole Wall 8 um
12Minimum Track/Gap of Single Layer Board0.025/0.03mm
13Minimum Track/Gap of Double Layer and Multilayer Board0.03/0.040mm
14Etching Tolerance±0.02mm
15Minimum Width of Silk Legend 0.125mm
16Minimum Heigh of Silk Legend0.75mm
17Distance from Legend to Pad0.15mm
18Distance from Opening Solder Mask of Drill Coverlay to Track0.03mm
19Distance from Opening Solder Mask of Punching Coverlay to Track0.03mm
20Thickness of Immersion Nickel100-300u"
21Thickness of Immersion Gold1-3u"
22Thicnkess of Immersion Tin150-400u"
23Minimum Electrical Testing Pad0.2mm
24Minimum Tolerance of Outline(Normal Steel Mould Punch)±0.1mm
25Minimum Tolerance of Outline (Precision Steel Mould Punch)±0.05mm
26Mininum Radius of Bevel Angle (Outline)0.2mm
27Stiffner MaterialPI, FR-4, 3M Adhesive, PET, Steel Sheet
28RoHsYes
29Solder Mask ColourYellow, White, Black, Green

 


 

 

 

 

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