Shenzhen Bicheng Electronics Technology Co., Ltd |
|
Hello everyone,
Today, we talk about the high frequency PCB made on RT/duroid 6002
material.
The RT/ duroid ® 6002 microwave material is a kind of low loss and
low dielectric constant laminate, which can meet the strict
requirements for mechanical reliability and electrical stability in
complex microwave structural design. The main components are PTFE
ceramics composites.
The dielectric constant of RT/duroid ®6002 has excellent resistance
to temperature change between -55 ℃ and 150 ℃, which can meet the
requirements of filter, oscillator and delay line application
design for its electrical stability.
The main advantages are:
Firstly, low loss ensures excellent high Frequency performance
Secondly, excellent mechanical and electrical properties, reliable
multi-layer board construction.
Thirdly, extremely low thermal coefficient of dielectric
constant,ensure excellent dimensional stability.
Fourthly, in-plane expansion coefficient matched to copper, allows
for more reliable surface mounted assemblies.
Fifthly, low outgassing, ideal for space applications
Typical applications are:
Phased Array Antennas
Round Based and Airborne Radar Systems
GPS antennas
Power Backplanes
Commercial Airline Collision Avoidance
The base copper of RT/druoid PCB has 0.5oz, 1oz and 2oz; the
thickness of PCB board is wide, ranging from 5mil to 120mil to be
considered by our designers.
PCB Capability (RT/duorid 6002)
PCB Material: | Ceramic-filled PTFE composite |
Designation: | RT/duroid 6002 |
Dielectric constant: | 2.94 ±0.04 (process) |
2.94 (design) | |
Layer count: | 2 Layer, Multilayer |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 10mil (0.254mm), 20mil (0.508mm) |
30mil (0.762mm), 60mil (1.524mm), 120mil (3.048mm) | |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
The basic colour of RT/duroid 6002 PCB is white.
RT/duroid 6002 PCB is very suited to the equipment of flat and
non-planar structures, such as antennas, complex multi-layer
circuits with inner-layer connections, and microwave circuits for
aerospace designs in hostile environments.
If you have any questions, please feel free to contact us. Thank
you for your reading.
Appendix:
RT/duroid 6002 Typical Value | |||||
Property | RT/duroid 6002 | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 2.94±0.04 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Dielectric Constant,εDesign | 2.94 | 8GHz to 40 GHz | Differential Phase Length Method | ||
Dissipation Factor,tanδ | 0.0012 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | +12 | Z | ppm/℃ | 10 GHz 0℃-100℃ | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 106 | Z | Mohm.cm | A | ASTM D 257 |
Surface Resistivity | 107 | Z | Mohm | A | ASTM D 257 |
Tensile Modulus | 828(120) | X,Y | MPa(kpsi) | 23℃ | ASTM D 638 |
Ultimate Stress | 6.9(1.0) | X,Y | MPa(kpsi) | ||
Ultimate Strain | 7.3 | X,Y | % | ||
Compressive Modulus | 2482(360) | Z | MPa(kpsi) | ASTM D 638 | |
Moisture Absorption | 0.02 | % | D48/50 | IPC-TM-650 2.6.2.1 ASTM D 570 | |
Thermal Conductivity | 0.6 | W/m/k | 80℃ | ASTM C518 | |
Coefficient of Thermal Expansion (-55 to 288℃) | 16 16 24 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |
Td | 500 | ℃ TGA | ASTM D 3850 | ||
Density | 2.1 | gm/cm3 | ASTM D 792 | ||
Specific Heat | 0.93(0.22) | j/g/k (BTU/ib/OF) | Calculated | ||
Copper Peel | 8.9(1.6) | Ibs/in.(N/mm) | IPC-TM-650 2.4.8 | ||
Flammability | V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |