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Hybrid RF and Microwave 5-layer Circuit Boards Built On 10mil RO4350B and FR-4

Shenzhen Bicheng Electronics Technology Co., Ltd
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Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China

Contact name:Sally Mao

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Shenzhen Bicheng Electronics Technology Co., Ltd

Hybrid RF and Microwave 5-layer Circuit Boards Built On 10mil RO4350B and FR-4

Country/Region china
City & Province shenzhen guangdong
Categories Solar Chargers
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Product Details

Hybrid RF and Microwave 5-layer Circuit Boards Built On 10mil RO4350B and FR-4

(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)

 

Hello everyone,

Warm greetings!

Today we’re going to introduce a type of 5-layer PCB built on mixed RF material RO4350B and epoxy glass FR-4. It’s for the application of 2.4 Ghz Antenna. It's 1.0 mm thick with through holes. Green solder mask covers both sides and immersion gold on pads. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.

 

 

The above drawing is the stack-up. “Layer 2” is etched off and left 5 layers of copper on board.

 

Features and benefits

1) Signal integrity performance improved over the stack-ups with all FR4 board;

2) 30000 square meter month capability;

3) 8000 types of PCB per month;

4) Quick CADCAM checking and free PCB quotation;

5) No MOQ, low cost for prototypes and small runs quantity;

6) IPC Class 2 / IPC Class 3 standard.

 

Applications are wide, for example, consumer electronics, antenna WiFi, 8 port switch, embedded computer DC transformer, inverter auto, WiFi 4G router and temperature module etc

 

Parameter and data sheet

PCB SIZE159.12 x 39.78mm=1PCS
BOARD TYPEHybrid Multilayer PCB
Number of Layers5 layers
Surface Mount ComponentsYES
Through Hole ComponentsYES
LAYER STACKUPcopper ------- 18um(0.5oz)+plate TOP layer
RO4350B 10 mil (0.254mm)
Prepreg 0.12mm
copper ------- 35um(1oz) MidLayer 1
FR-4 0.152mm
copper ------- 35um(1oz) MidLayer 2
Prepreg 0.12mm
copper ------- 35um(1oz) MidLayer 3
FR-4 0.152mm
copper ------- 18um(0.5oz)+plate BOT layer
TECHNOLOGY 
Minimum Trace and Space:5 mil / 5 mil
Minimum / Maximum Holes:0.4 mm / 5.0 mm
Number of Different Holes:7
Number of Drill Holes:81
Number of Milled Slots:2
Number of Internal Cutouts:0
Impedance Control:no
Number of Gold finger:0
BOARD MATERIAL 
Glass Epoxy:FR-4 Tg130℃, er<5.4; RO4350B Tg280℃, er < 3.8
Final foil external:1 oz
Final foil internal:1 oz
Final height of PCB:1.0 mm ±0.1
PLATING AND COATING 
Surface FinishImmersion gold (14.6% ) 0.05µm over 3µm nickel
Solder Mask Apply To:TOP and Bottom, 12micron Minimum
Solder Mask Color:Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type:LPSM
CONTOUR/CUTTINGCNC Routing
MARKING 
Side of Component LegendTOP and Bottom.
Colour of Component LegendWhite, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo:Marked on the board in a conductor and leged FREE AREA
VIAPlated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE 
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.
 
 
 

 

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