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RF Hybrid High Frequency PCB 4 Layer Hybrid PCB Built On 8mil 0.203mm RO4003C and FR-4

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Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China

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Shenzhen Bicheng Electronics Technology Co., Ltd

RF Hybrid High Frequency PCB 4 Layer Hybrid PCB Built On 8mil 0.203mm RO4003C and FR-4

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City & Province shenzhen guangdong
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Product Details

RF Hybrid High Frequency PCB 4 Layer Hybrid PCB Built On 8mil 0.203mm RO4003C and FR-4

(PCB’s are custom-made products, the picture and parameters shown are just for reference)

 

Hello everyone,

Warm greetings!

Today we’ll see a type of 4 layer hybrid PCB built on 0.203mm (8mil) RO4003C and FR-4 for the application of attenuator. It's 1.1 mm thick with blue solder mask and immersion silver on pads. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.

 

Let’s see the stack-up.

 

 

Layer 1 to layer 2 is the RO4003C core, then the left are FR-4 material. Boards are through holes.

Let’s see the micro-section.

 

 

Features and Benefits

1) RO4003C exhibit a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications.

2) Signal integrity performance improvement over the stack-ups with all FR4 board

3) Thermal stress test, reliability test, insulation resistance test and ionic contamination test, AOI test etc.

4) No MOQ

5) Experienced sales persons provide skilled customer services.

 

Applications

RF transceiver Power divider LNB Attenuator Directional coupler Photocoupler

 

Parameter and Data Sheet

PCB SIZE140 x 35 mm=1PCS
BOARD TYPEMultilayer PCB
Number of Layers4 layers
Surface Mount ComponentsYES
Through Hole ComponentsYES
LAYER STACKUPcopper ------- 35um TOP layer
RO4003C 0.203mm
copper ------- 35um(1oz) MidLayer 1
FR-4 0.5mm
copper ------- 35um(1oz) MidLayer 2
FR-4 0.2mm
copper ------- 35um BOT layer
TECHNOLOGY 
Minimum Trace and Space:7.8 mil / 4.4 mil
Minimum / Maximum Holes:0.3 mm / 2.5 mm
Number of Different Holes:4
Number of Drill Holes:91
Number of Milled Slots:0
Number of Internal Cutouts:0
Impedance Control:no
Number of Gold finger:0
BOARD MATERIAL 
Glass Epoxy:Rogers RO4003C +FR4 hybrid material
Final foil external:1 oz
Final foil internal:1 oz
Final height of PCB:1.1 mm ±0.11
PLATING AND COATING 
Surface FinishImmersion silver
Solder Mask Apply To:TOP and Bottom, 12micron Minimum
Solder Mask Color:Blue, KSM-6189BL04/KSM-19H01
Solder Mask Type:LPSM
CONTOUR/CUTTINGRouting
MARKING 
Side of Component LegendNO
Colour of Component LegendNO
Manufacturer Name or Logo:NO
VIAPlated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE 
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

 

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