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Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Cirucit Board DK3.0 DF 0.001 Microwave PCB

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Shenzhen Bicheng Electronics Technology Co., Ltd

Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Cirucit Board DK3.0 DF 0.001 Microwave PCB

Country/Region china
City & Province shenzhen guangdong
Categories Electronics Production Machinery
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Product Details

Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Cirucit Board DK3.0 DF 0.001 Microwave PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers RO3003 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3003 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.

 

Typical applications:

1) Automotive radar

2) Cellular telecommunications systems

3) Datalink on cable systems

4) Direct broadcast satellites

5) Global positioning satellite antennas

6) Patch antenna for wireless communications

7) Power amplifiers and antennas

8) Power backplanes

9) Remote meter readers

 

PCB Specifications

PCB SIZE100 x 100mm=1PCS
BOARD TYPEDouble sided PCB
Number of Layers2 layers
Surface Mount ComponentsNO
Through Hole ComponentsNO
LAYER STACKUPcopper ------- 35 um(1 oz)
RO3003 0.254mm
copper ------- 35 um(1 oz)
TECHNOLOGY 
Minimum Trace and Space:5mil / 5mil
Minimum / Maximum Holes:0.3mm / 0.8mm
Number of Different Holes:N/A
Number of Drill Holes:N/A
Number of Milled Slots:N/A
Number of Internal Cutouts:N/A
Impedance Control:N/A
Number of Gold finger:N/A
BOARD MATERIAL 
Glass Epoxy:RO3003 0.254mm
Final foil external:1oz
Final foil internal:N/A
Final height of PCB:0.3 mm ±0.1
PLATING AND COATING 
Surface FinishN/A
Solder Mask Apply To:N/A
Solder Mask Color:N/A
Solder Mask Type:N/A
CONTOUR/CUTTINGRouting
MARKING 
Side of Component LegendN/A
Colour of Component LegendN/A
Manufacturer Name or Logo:N/A
VIAN/A
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE 
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TESTN/A
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

 

 

Data Sheet of Rogers 3003 (RO3003)

RO3003 Typical Value
PropertyRO3003DirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.0±0.04Z 10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3Z 8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.001Z 10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-3Zppm/℃10 GHz -50℃to 150℃IPC-TM-650 2.5.5.5
Dimensional Stability0.06
0.07
X
Y
mm/mCOND AIPC-TM-650 2.2.4
Volume Resistivity107 MΩ.cmCOND AIPC 2.5.17.1
Surface Resistivity107 COND AIPC 2.5.17.1
Tensile Modulus930
823
X
Y
MPa23℃ASTM D 638
Moisture Absorption0.04 %D48/50IPC-TM-650 2.6.2.1
Specific Heat0.9 j/g/k Calculated
Thermal Conductivity0.5 W/M/K50℃ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
16
25
X
Y
Z
ppm/℃23℃/50% RHIPC-TM-650 2.4.4.1
Td500 ℃ TGA ASTM D 3850
Density2.1 gm/cm323℃ASTM D 792
Copper Peel Stength12.7 Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
FlammabilityV-0   UL 94
Lead-free Process CompatibleYes    
 
 
 
 
 

 

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