Active Member
|
[China]
Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Contact name:Sally Mao
Shenzhen Bicheng Electronics Technology Co., Ltd |
|
|
High Tg Lead Free Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS with 0.5oz-3oz Copper 0.5-3.2mm Thick
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
IT-180ATC is an advanced high Tg (175℃ by DSC) multifunctional filled epoxy with high thermal reliability and CAF resistance. It’s suitable for various application and can pass 260℃ lead free assembly.
Applications
Automotive (Engine room ECU)
Multilayer and HDI PCB
Backplanes
Data Storage
Server and Networking
Telecommunications
Heavy Copper
Key Features
Low CTE
High heat resistance
Excellent CAF resistance
Good through-hole reliability
Our PCB Capability (IT-180ATC)
| PCB Material: | High Tg, Lead Free High Reliability Epoxy Resin |
| Designation: | IT-180ATC |
| Dielectric constant: | 4.4 at 1GHz |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm) |
| PCB thickness: | 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc.. |
| Technology: | HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc. |
Appendix: General Properties of IT-180ATC
| Items | IPC TM-650 | Typical Value | Unit |
| Peel Strength, minimum | 2.4.8 | lb/inch | |
| A. Low profile copper foil | 5 | ||
| B. Standard profile copper foil | 8 | ||
| Volume Resistivity | 2.5.17.1 | 1x109 | M-cm |
| Surface Resistivity | 2.5.17.1 | 1x108 | M |
| Moisture Absorption, maximum | 2.6.2.1 | 0.1 | % |
| Permittivity (Dk, 50% resin content) | -- | ||
| A. 1MHz | 2.5.5.9 | 4.5 | |
| B. 1GHz | 2.5.5.9 | 4.4 | |
| Loss Tangent (Df, 50% resin content) | -- | ||
| A. 1MHz | 2.5.5.9 | 0.014 | |
| B. 1GHz | 2.5.5.9 | 0.015 | |
| Flexural Strength, minimum | N/mm2 | ||
| A. Length direction | 2.4.4 | 500-530 | |
| B. Cross direction | 410-440 | ||
| Thermal Stress 10 s at 288°C | |||
| A. Unetched | 2.4.13.1 | Pass | Rating |
| B. Etched | Pass | ||
| Flammability | UL94 | V-0 | Rating |
| Comparative Tracking Index (CTI) | IEC 60112 / UL 746 | CTI 3 (175-249) | Class (Volts) |
| Glass Transition Temperature(DSC) | 2.4.25 | 175 | ˚C |
| Decomposition Temperature | 2.4.24.6 | 345 | ˚C |
| X/Y Axis CTE (40℃ to 125℃) | 2.4.41 | 11-13 / 13-15 | ppm/˚C |
| Z-Axis CTE | |||
| A. Alpha 1 | 45 | ppm/˚C | |
| B. Alpha 2 | 2.4.24 | 210 | ppm/˚C |
| C. 50 to 260 Degrees C | 2.7 | % | |
| Thermal Resistance | |||
| A. T260 | 2.4.24.1 | >60 | Minutes |
