Active Member
|
[China]
Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Contact name:Sally Mao
Shenzhen Bicheng Electronics Technology Co., Ltd |
|
|
High Tg Lead Free Multilayer Printed Circuit Board Built on TU-768 Core and TU-768P Prepreg
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.
Main Applications
Consumer Electronics
Server, workstation
Automotive
Key Features
Lead Free process compatible
Excellent coefficient of thermal expansion
Anti-CAF property
Superior chemical and thermal resistance
Fluorescence for AOI
Moisture resistance
Our PCB Capability (TU-768)
| PCB Material: | High-Tg and High Thermal Reliability Epoxy Resin |
| Designation: | TU-768 |
| Dielectric constant: | 4.3 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm) |
| PCB thickness: | 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc.. |
| Technology: | HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc. |
Typical Properties of TU-768
| Typical Values | Conditioning | IPC-4101 /126 | |
| Thermal | |||
| Tg (DMA) | 190°C | ||
| Tg (DSC) | 180°C | > 170°C | |
| Tg (TMA) | 170°C | E-2/105 | |
| Td (TGA) | 350°C | > 340°C | |
| CTE x-axis | 11~15 ppm/°C | N/A | |
| CTE y-axis | 11~15 ppm/°C | E-2/105 | N/A |
| CTE z-axis | 2.70% | < 3.0% | |
| Thermal Stress,Solder Float, 288°C | > 60 sec | A | > 10 sec |
| T260 | > 60 min | > 30 min | |
| T288 | > 20 min | E-2/105 | > 15 min |
| T300 | > 2 min | > 2 min | |
| Flammability | 94V-0 | E-24/125 | 94V-0 |
| DK & DF | |||
| Permittivity (RC 50%) @10GHz | 4.3 | ||
| Loss Tangent (RC 50%) @10GHz | 0.018 | ||
| Electrical | |||
| Permittivity (RC50%) | |||
| 1GHz (SPC method/4291B) | 4.4 / 4.3 | < 5.2 | |
| 5GHz (SPC method) | 4.3 | E-2/105 | N/A |
| 10GHz (SPC method) | 4.3 | N/A | |
| Loss Tangent (RC50%) | |||
| 1GHz (SPC method/4291B) | 0.019 /0.018 | < 0.035 | |
| 5GHz (SPC method) | 0.021 | E-2/105 | N/A |
| 10GHz (SPC method) | 0.023 | N/A | |
| Volume Resistivity | > 1010 MΩ•cm | C-96/35/90 | > 106 MΩ•cm |
| Surface Resistivity | > 108 MΩ | C-96/35/90 | > 104 MΩ |
| Electric Strength | > 40 KV/mm | A | > 30 KV/mm |
| Dielectric Breakdown | > 50 kV | A | > 40 KV |
| Mechanical | |||
| Young’s Modulus | |||
| Warp Direction | 25 GPa | A | N/A |
| Fill Direction | 22 GPa | ||
| Flexural Strength | |||
| Lengthwise | > 60,000 psi | A | > 60,000 psi |
| Crosswise | > 50,000 psi | A | > 50,000 psi |
| Peel Strength, 1.0 oz RTF Cu foil | 7~9 lb/in | A | > 4 lb/in |
| Water Absorption | 0.18% | E-1/105+D-24/23 | < 0.8 % |
