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Taconic RF-35TC High Frequency PCB With 10mil, 20mil, 30mil and 60mil Thick Coating Immersion Gold and Immersion Silver

Shenzhen Bicheng Electronics Technology Co., Ltd
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Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China

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Shenzhen Bicheng Electronics Technology Co., Ltd

Taconic RF-35TC High Frequency PCB With 10mil, 20mil, 30mil and 60mil Thick Coating Immersion Gold and Immersion Silver

Country/Region china
City & Province shenzhen guangdong
Categories Electronics Production Machinery
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Product Details

Taconic RF-35TC High Frequency PCB With 10mil, 20mil, 30mil and 60mil Thick Coating Immersion Gold, Immersion Silver and Immersion Tin

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Hello Everyone,

Today, we introduce high frequency PCB built on RF-35TC.

RF-35TC is a PTFE based, ceramic filled fiberglass high frequency material from Taconic company.

 

First, take a look at some of its advantages:

 

 

Exceptional thermal management

This material offers superior heat dissipation performance, so it's a type of thermally conductive low loss laminate. It's best suited for high power applications. Heat dissipates away from both transmission line on PCB and surface mount components such as capacitor etc.

 

Similarly, Dk stability is across a broad temperature range; antenna gains and efficiencies are enhanced, RF-35TC bonds very well to Low Profile copper, reducing insertion loss.

 

Going back to the table, let’s take a look at its main applications:

1. Power amplifiers: The extremely low Df of 0.0011 and high thermal conductivity are particular suited for power amplifier applications.

2. Couplers: The Low Z axis CTE and temperature stable Dk are critical for both narrow and broad band overlay couplers.

3. Filters: The low X and Y CTE values are crucial for maintaining critical distances between trace elements in a printed filter

 

In addition, It’s also widely used in antennas, satellite equipment and so on. Next, let’s take a look at our PCB capabilities.

 

Our PCB Capability (RF-35TC)

PCB Material:PTFE based ceramic filled fiberglass substrate 
Designator:RF-35TC 
Dielectric constant @ 10GHz:3.50 
 
Layer count:1 Layer, 2 Layer, Multilayer, Hybrid type 
Copper weight:0.5oz, 1oz, 2oz 
PCB thickness:0.3mm, 0.6mm, 0.8mm, 1.6mm 
(10mil, 20mil, 30mil, 60mil substrate) 
Solder mask:Green, Red, Black, White, Blue etc. 
PCB size:≤400mm X 500mm 
Surface finish:Bare copper, HASL, ENIG, Immersion tin etc. 
   

 

At present, our company can provide single sided PCB, double sided PCB, multi-layer PCB and hybrid PCB.

The copper thickness is mainly 1oz and 2oz.

According to different uses, there are many kinds of thickness to choose from, such as 0.3mm, 0.6mm, 0.8mm and 1.6mm.

The color of solder mask is available in green, red, black, white and blue etc.

Our maximum PCB size is within 400X 500mm.

A variety of surface finishes are available, such as bare copper, Hot air level, immersion gold and immersion tin .

 

 

The basic colour of RF-35TC PCB is brown and grey.

 

Our company focuses on prototypes, small batch and mass production. Should you have any questions, please feel free to contact us.

Thank you for reading.

 

Appendix: Data Sheet RF-35TC

RF-35TC TYPICAL VALUES
PropertyTest MethodUnitValueUnitValue
DK @10 GHzIPC-650 2.5.5.5.1(modified) 3.5 3.5
Tck(-30 to 120℃)IPC-650 2.5.5.5.1(modified)ppm24ppm24
Df @10 GHzIPC-650 2.5.5.5.1(modified) 0.0011 0.0011
Dielectric BreakdownIPC-650 2.5.6(in-Plane,Two Pins in Oil)kV56.7kV56.7
Dielectric StrengthASTM D 149(Through Plane)V/mil570V/mm22,441
Arc ResistanceIPC-650 2.5.1Seconds304Seconds304
Moisture AbsorptionIPC-650 2.6.2.1%0.05%0.05
Flexural Strength(MD)ASTM D 790/IPC-650 2.4.4psi12,900N/mm288.94
Flexural Strength(CD)ASTM D 790/IPC-650 2.4.4psi11,700N/mm280.67
Tensile Strength(MD)ASTM D 3039/IPC-TM-650 2.4.19psi9,020N/mm262.19
Tensile Strength(CD)ASTM D 3039/IPC-TM-650 2.4.19psi7,740N/mm253.37
Elongation at Break(MD)ASTM D 3039/IPC-TM-650 2.4.19%1.89N/mm1.89
Elongation at Break(CD)ASTM D 3039/IPC-TM-650 2.4.19%1.7%1.7
Young's Modulus(MD)ASTM D 3039/IPC-TM-650 2.4.19psi667,000N/mm24,599
Young's Modulus(CD)ASTM D 3039/IPC-TM-650 2.4.19psi637,000N/mm24,392
Poisson's Ratio(MD)ASTM D 3039/IPC-TM-650 2.4.19 0.18 0.18
Poisson's Ratio(CD)ASTM D 3039/IPC-TM-650 2.4.19 0.23 0.18
Compressive ModulusASTM D 695(23℃)psi560,000N/mm23,861
Flexural Strength(MD)ASTM D 790/IPC-650 2.4.4psi1.46 x 106N/mm210,309
Flexural Strength(CD)ASTM D 790/IPC-650 2.4.4psi1.50 x 106N/mm210,076
Peel Stength(½ oz.CVH)IPC-650 2.4.8(Thermal Stress.)Ibs./inch7g/cm31.25
Thermal Conductivity(Unclad,125℃)ASTM F433(Guarded Heat Flow)W/(mK)0.6W/(mK)0.6
Thermal Conductivity(C1/C1,125℃)ASTM F433(Guarded Heat Flow)W/(mK)0.92W/(mK)0.92
Thermal Conductivity(CH/CH,125℃)ASTM F433(Guarded Heat Flow)W/(mK)0.87W/(mK)0.87
Dimensional Stability(MD)IPC-650-2.4.39 Sec.5.4(After Etch)mils/in.0.23mm/M0.23
Dimensional Stability(CD)IPC-650-2.4.39 Sec.5.4(After Etch)mils/in.0.64mm/M0.64
Dimensional Stability(MD)IPC-650-2.4.39 Sec.5.5(Thermal Stress.)mils/in.-0.04mm/M-0.04
Dimensional Stability(CD)IPC-650-2.4.39 Sec.5.5(Thermal Stress.)mils/in.0.46mm/M0.46
Surface ResistivityIPC-650 2.5.17.1(after elevated temp.)Mohms8.33 x 107Mohms8.33 x 107
Surface ResistivityIPC-650 2.5.17.1(after humidity)Mohms6.42 x 107Mohms6.42 x 107
Volume ResistivityIPC-650 2.5.17.1(after elevated temp.)Mohms/cm5.19 x 108Mohms/cm5.19 x 108
Volume ResistivityIPC-650 2.5.17.1(after humidity)Mohms/cm2.91 x 108Mohms/cm2.91 x 108
CTE(X axis)(25-260℃)IPC-650 2.4.41/ASTM D 3386ppm/℃11ppm/℃11
CTE(Y axis)(25-260℃)IPC-650 2.4.41/ASTM D 3386ppm/℃13ppm/℃13
CTE(Z axis)(25-260℃)IPC-650 2.4.41/ASTM D 3386ppm/℃34ppm/℃34
DensityASTM D 792g/cm32.35g/cm32.35
HardnessASTM D 2240(Shore D) 79.1 79.1
Strain at Break(MD)ASTM D 790/IPC-650 2.4.4%0.014%0.014
Strain at Break(CD)ASTM D 790/IPC-650 2.4.4%0.013%0.013
Specific HeatASTM E 1269-05,E 967-08,E968-02j/(g℃)0.94j/(g℃)0.94
Td(2% Weight Loss)IPC-650 2.4.24.6/TGAoF788420
Td(5% Weight Loss)IPC-650 2.4.24.6/TGAoF817436

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