Active Member
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[China]
Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Contact name:Sally Mao
Shenzhen Bicheng Electronics Technology Co., Ltd |
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6 Layers High Tg Printed Circuit Board (PCB) Made on S1000-2M With Immersion Gold and 90 Ohm Impedance Control for Communications
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Brief Introduction
This is a type of high Tg PCB with differential impedance on layer 3 at 6mil/7mil, 6mil/10mil; and layer 4 at 7mil/7mil and 6mil/7mil track/gap. It is made on high performance and low CTE FR-4 S1000-2M (for more details about S1000-2M, please refer to Shengyi S1000-2M Core and S1000-2MB Prepreg High Tg Printed Circuit Board (PCB) 0.05mm-3.2mm Thick 12um-105um Copper). It’s 6-layer board with 1 oz copper each layer, coating with immersion gold and blue solder mask. It’s supplied by individual board with V-cut. 25 boards are packed for shipment.
Applications
Computers
Communications
Automotive electronics etc.
PCB Parameters
| Item | Description | Requirement | Actual | Result | ||
| 1. Laminate | Material Type | FR-4 S1000-2M | FR-4 S1000-2M | ACC | ||
| Tg | 170 | ℃ | 170 | ℃ | ACC | |
| Supplier | SHENGYI | SHENGYI | ACC | |||
| Thickness | 1.6 | ±10% mm | 1.63-1.68 | mm | ACC | |
| 2.Plating thickness | Hole Wall | ≥25 | µm | 30.17 | µm | ACC |
| Outer copper | 35 | µm | 41.09 | µm | ACC | |
| Inner Copper | 30 | µm | 33.69 | µm | ACC | |
| 3.Solder mask | Material Type | KSM-S6189BL04 | KSM-S6189BL04 | ACC | ||
| Color | Blue | Blue | ACC | |||
| Rigidity (Pencil Test) | ≥4H or above | 5H | ACC | |||
| S/M Thickness | ≥10 | µm | 20.11 | µm | ACC | |
| Location | Both Sides | Both Sides | ACC | |||
| 4. Component Mark | Material Type | TAIYO/ IJR-4000 MW300 | IJR-4000 MW300 | ACC | ||
| Color | White | White | ACC | |||
| Location | C/S | C/S | ACC | |||
| 5. Peelable Solder Mask | Material Type | |||||
| Thickness | ||||||
| Location | ||||||
| 6. Identification | UL Mark | YES | YES | ACC | ||
| Date Code | WWYY | 0421 | ACC | |||
| Mark Location | Solder Side | Solder Side | ACC | |||
| 7. Surface Finish | Method | Immersion Gold | Immersion Gold | ACC | ||
| Tin Thickness | ||||||
| Nickel Thickness | 3-6 | µm | 4.06 | µm | ACC | |
| Gold Thickness | 0.1 | µm | 0.12 | µm | ACC | |
| 8. Normativeness | RoHS | Directive 2015/863/EU | OK | ACC | ||
| REACH | Directive 1907 /2006 | OK | ACC | |||
| 9.Annular Ring | Min. Line Width (mil) | 6.00 | mil | 5.80 | mil | ACC |
| Min. Spacing (mil) | 5.00 | mil | 5.20 | mil | ACC | |
| 10.V-groove | Angle | |||||
| Residual thickness | ||||||
| 11. Beveling | Angle | |||||
| Height | ||||||
| 12. Function | Electrical Test | 100% PASS | 100% PASS | ACC | ||
| 13. Appearance | IPC Class Level | IPC-A-600J &6012D Class 2 | IPC-A-600J &6012D Class 2 | ACC | ||
| Visual Inspection | IPC-A-600J &6012D Class 2 | IPC-A-600J &6012D Class 2 | ACC | |||
| Warp and Twist | ≦ | 0.70% | 0.21% | ACC | ||
| 14. Reliability Test | Tape Test | No Peeling | OK | ACC | ||
| Solvent Test | No Peeling | OK | ACC | |||
| Solderability Test | 265 ±5℃ | OK | ACC | |||
| Thermal Stress Test | 288 ±5℃ | OK | ACC | |||
| Ionic Contamination Test | ≦ 1.56 µg/c㎡ | 0.56 | µg/c㎡ | ACC | ||
Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075; NPTH±0.05
| Hole Code | PTH | Required | Actual value | Result | |||
| 1 | Y | 0.375 | 0.375 | 0.400 | 0.400 | 0.375 | ACC |
| 2 | Y | 0.500 | 0.500 | 0.550 | 0.525 | 0.525 | ACC |
| 3 | Y | 0.7*2.4 | 0.7*2.4 | 0.7*2.41 | 0.69*2.4 | 0.7*2.4 | ACC |
| 4 | Y | 0.625 | 0.625 | 0.600 | 0.625 | 0.600 | ACC |
| 5 | Y | 0.725 | 0.725 | 0.725 | 0.750 | 0.725 | ACC |
| 6 | Y | 0.900 | 0.925 | 0.900 | 0.900 | 0.900 | ACC |
| 7 | Y | 1.000 | 1.000 | 0.950 | 0.975 | 1.000 | ACC |
| 8 | N | 1.050 | 1.050 | 1.050 | 1.075 | 1.050 | ACC |
| 9 | Y | 1.300 | 1.300 | 1.300 | 1.325 | 1.325 | ACC |
| 10 | Y | 1.350 | 1.350 | 1.325 | 1.350 | 1.325 | ACC |
| 11 | Y | 1.575 | 1.575 | 1.600 | 1.600 | 1.575 | ACC |
| 12 | Y | 1.650 | 1.650 | 1.700 | 1.675 | 1.675 | ACC |
| 13 | Y | 1.700 | 1.700 | 1.750 | 1.725 | 1.725 | ACC |
| 14 | Y | 3.250 | 3.250 | 3.250 | 3.275 | 3.250 | ACC |
| 15 | Y | 3.450 | 3.450 | 3.400 | 3.425 | 3.450 | ACC |
| 16 | Y | 0.7*2.6 | 0.7*259 | 0.7*2.61 | 0.69*2.6 | 0.7*2.59 | ACC |
Electrical Test Report
| Test Type | Flying Probe | Testing Points | 1250 | Testing Time | 1/25/2021 | Quantity | 80 | Pieces |
| Testing Condition | Voltage | 250V | Conductive Resistance | 20 Ω | ||||
| Current | 100 mA | Isulation Resistance | 20 mΩ | |||||
| Testing Result | Quantity Passed | 80 | Pieces | Passing Rate | 100% | |||
| Quantity Rejected | 0 | Pieces | ||||||
| Open Circuits | 0 | Pieces | Short Circuits | 0 | Pieces | |||
| Conductive Non-confirming | 0 | Pieces | Insulation Non-confirming | 0 | Pieces | |||
Impedance Test Report
| Sample NO. | Layer | Line Width(mil)±10% | Line Space (mil)±10% | Impedance Type | Required Value (ohm) | Tolerance | Actual Value | Result | |
| Single End | Differential | ||||||||
| 1 | L3 | 6.000 | 7.000 | V | 90.00 | ±10% | 93.59 | ACC | |
| L3 | 6.000 | 10.000 | V | 100.00 | ±10% | 102.33 | ACC | ||
| L4 | 7.000 | 7.000 | V | 90.00 | ±10% | 88.99 | ACC | ||
| L4 | 6.000 | 7.000 | V | 90.00 | ±10% | 90.76 | ACC | ||
