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High Frequency PCB Rogers 20mil 0.508mm RO4350B PCB Double Sided RF PCB for Splitter

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Shenzhen Bicheng Electronics Technology Co., Ltd

High Frequency PCB Rogers 20mil 0.508mm RO4350B PCB Double Sided RF PCB for Splitter

Country/Region china
City & Province shenzhen guangdong
Categories Electrical Wires
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Product Details

High Frequency PCB Rogers 20mil 0.508mm RO4350B Double Sided RF PCB for Splitter

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RO4350B hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The selection of laminates typically available to designers is significantly reduced once operational frequencies increase to 500 MHz and above. RO4350B material possesses the properties needed by designers of RF microwave circuits and matching networks and controlled impedance transmission lines. Low dielectric loss allows RO4350B material to be used in many applications where higher operating frequencies limit the use of conventional circuit board materials.

 

 

The temperature coefficient of dielectric constant is among the lowest of any circuit board material, and the dielectric constant is stable over a broad frequency range. RO4350B material's thermal coefficient of expansion(CTE) provides several key benefits to the PCB designers. The expansion coefficient of RO4350B is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions. The low Z-axis CTE of RO4350B provides reliable plated through-hole quality, even in severe thermal shock applications. RO4350B material has a Tg of >280C so its expansion characteristics remain stable over the entire range of PCB processing temperatures.

 

PCB Specifications

PCB SIZE26 x 83mm=1PCS
BOARD TYPE 
Number of LayersDouble sided PCB, 2 Layer PCB
Surface Mount ComponentsYES
Through Hole Componentsno
LAYER STACKUPcopper ------- 35um(1oz)+plate TOP layer
RO4350B 20mil (0.508mm)
copper ------- 35um(1oz)+plate BOT Layer
TECHNOLOGY 
Minimum Trace and Space:5.98mil/6.18mil
Minimum / Maximum Holes:0.3/3.2mm
Number of Different Holes:5
Number of Drill Holes:431
Number of Milled Slots:0
Number of Internal Cutouts:no
Impedance Controlno
BOARD MATERIAL 
Glass Epoxy:RO4350B 20mil (0.508mm), Tg 288℃
Final foil external:1.5oz
Final foil internal:0oz
Final height of PCB:0.6mm ±0.1
PLATING AND COATING 
Surface FinishImmersion Gold (81.1%) 2µ" over 100µ" nickel
Solder Mask Apply To:Top and Bottom, 12micron Minimum
Solder Mask Color:Green, LP-4G G-05, Nanya supplied
Solder Mask Type:LPSM
CONTOUR/CUTTINGRouting
MARKING 
Side of Component LegendTOP
Colour of Component LegendWhite, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:Marked on the board in a conductor and leged FREE AREA
VIAPlated Through Hole(PTH)
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE 
Outline dimension:0.0059" (0.15mm)
Board plating:0.0030" (0.076mm)
Drill tolerance:0.002" (0.05mm)
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

 

 

Typical applications are as follows:

Automotive Radar and Sensors

Cellular Base Station Antennas

Direct Broadcast Satellites

Low Noise Block

Power amplifiers

RFID

 

 

Data sheet of Rogers 4350B (RO4350B )

RO4350B Typical Value
PropertyRO4350BDirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.48±0.05Z 10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.66Z 8 to 40 GHzDifferential Phase Length Method
Dissipation Factortan,δ0.0037
0.0031
Z 10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε+50Zppm/℃-50℃to 150℃IPC-TM-650 2.5.5.5
Volume Resistivity1.2 x 1010 MΩ.cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity5.7 x109 COND AIPC-TM-650 2.5.17.1
Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
Tensile Modulus16,767(2,432)
14,153(2,053)
X
Y
MPa(ksi)RTASTM D 638
Tensile Strength203(29.5)
130(18.9)
X
Y
MPa(ksi)RTASTM D 638
Flexural Strength255
(37)
 MPa
(kpsi)
 IPC-TM-650 2.4.4
Dimensional Stability<0.5X,Ymm/m
(mil/inch)
after etch+E2/150℃IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion10
12
32
X
Y
Z
ppm/℃-55℃to288℃IPC-TM-650 2.4.41
Tg>280 ℃ TMAAIPC-TM-650 2.4.24.3
Td390 ℃ TGA ASTM D 3850
Thermal Conductivity0.69 W/M/oK80℃ASTM C518
Moisture Absorption0.06 %48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density1.86 gm/cm323℃ASTM D 792
Copper Peel Stength0.88
(5.0)
 N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability(3)V-0   UL 94
Lead-free Process CompatibleYes    
 
 
 
 

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