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Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module

Shenzhen Bicheng Electronics Technology Co., Ltd
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Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China

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Shenzhen Bicheng Electronics Technology Co., Ltd

Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module

Country/Region china
City & Province shenzhen guangdong
Categories Plastic Rods
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Product Details

Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module

(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)

 

General description

This is a type of 2 Layer flexible printed circuit (FPC) built on 2oz polyimide for the application of Interface Module.

 

Basic specifications

Base material: Polyimide 25μm

Layer count: 2 layers

Type: Individual FPC

Format: 105mm x 42.3mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 70μm/ Inner layer 0 μm

Solder mask / Legend: Yellow coverlay / No.

Final PCB height: 0.25 mm

Standard: IPC 6012 Class 2

Packing: 100 pieces are packed for shipment.

Lead time: 10 working days

Shelf life: 6 months

 

 

Features and benefits

Reliability increased;

Controllability of electrical parameter design;

The end can be whole soldered;

SMT process is resistant to reflow soldering, resistant to rework;

Professional and experienced engineers check your production files

Competitive price;

No MOQ, low cost for prototypes and small runs quantity;

8000 types of PCB's per month;

 

Applications

Thin-film switch, contact belt of inkjet printer, industrial control interphone, medical keypad soft board, contact belt of inkjet printer projector soft board

 

Specifications of Standard 2 Layer FCCL

Double sided adhesiveless flexible copper clad laminate (SF202)
SpecificationsThickness (µm)Copper TypeApplications
Polyimide FilmCopper Foil
SF202 0512DT12.512RTFCamera, LCM, TP etc..
SF202 0812DT2012RTF
SF202 1012DT2512RTF
SF202 0518DT12.518RTFBatter FPC
SF202 0818DT2018RTF
SF2021018DT2518RTF
SF202 0512DR12.512RACamera, LCM, TP etc..
SF202 0812DR2012RA
SF202 1012DR2512RA
SF202 0518DR12.518RA
SF202 0818DR2018RA
SF202 1018DR2518RA
SF202 0535DT12.535RTFBatter FPC
SF202 1035DT2535RTF
SF202 0535DR12.535RA
SF202 1035DR2535RA
     
Specifications of New FCCL    
Double sided adhesiveless flexible copper clad laminate (SF202)
SpecificationsThickness (µm)Copper TypeApplications
Polyimide FilmCopper Foil
SF202 0506DR12.56RAFine-line
SF20200509DR129RA
SF202 0509DT129RTF
SF202 0812DR2012RASide switch
SF202 1012DR2512RA
SF202 0545DT12.545RTFWireless Charge
SF202 1045DT2545RTF
SF202 0550DT12.550RTF
SF202 1050DT2550RTF
SF202 0570DT12.570RTF
SF202 1070DT2570RTF
SF202 101850DT2518, 50RTF
SF202 101870DT2518,70RTF

 

Clarifications of FPC

According to the combination of base material and copper foil, flexible circuit board can be divided into two types: flexible board with adhesive and flexible board without adhesive. The price of non-adhesive flexible PCB is much higher than that of adhesive flexible PCB, but its flexibility, bonding force between copper foil and substrate and flatness of solder are also better than that of adhesive flexible PCB. So it is only used in the high demand situations, such as the: COF (CHIP ON FLEX, flexible board with bare chip, the high flatness of the pad) and so on. Because its price is high, most of the flexible PCBs used in the market are still adhesive flexible circuit board. Because the flexible circuit board is mainly used in the situation where bending is required, if the design or process is not reasonable, it is easy to produce micro-cracks, welding and other defects.

 

Economy of using FPC

If the circuit design is relatively simple, the total volume is small, and the space is suitable, the traditional internal connection is much cheaper. Flexible circuits are a good design option if the circuit is complex, processes many signals or has special electrical or mechanical requirements. When the size and performance of applications exceed the capacity of rigid circuits, flexible assembly is the most economical. A 12mil pad with a 5mil through hole and a flexible circuit with 3mil lines and spacing can be fabricated on a thin film. Therefore, it is more reliable to mount the chip directly on the film. There is no flame retardant that could be an ion source. These films may be protective and solidified at higher temperatures to obtain higher glass transition temperatures. Flexible materials are less costly than rigid materials because they are free of connectors.

 
 
 
 

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