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Rogers RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for Base Station Power Amplifiers

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Shenzhen Bicheng Electronics Technology Co., Ltd

Rogers RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for Base Station Power Amplifiers

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City & Province shenzhen guangdong
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Product Details

Rogers RO4360 RF PCB 12mil Double Sided High Frequency PCB with Immersion Gold for Base Station Power Amplifiers

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

RO4360G2 laminates of Rogers Corporation are 6.15 Dk, low loss, glass-reinforced, hydrocarbon ceramic-filled thermoset materials that provide the ideal balance of performance and processing ease. RO4360G2 laminates extend Rogers' portfolio of high performance materials by providing customers with a product that is lead-free process capable and offers better rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs.

 

RO4360G2 laminates process similar to FR-4 and are automated assembly compatible. They have a low Z-axis CTE for design flexibility and have the same high Tg as all of the RO4000 product line. RO4360G2 laminates can be paired with RO4450F prepreg and lower-Dk RO4000 laminate in multi-layer designs.

 

RO4360G2 laminates, with a Dk of 6.15 (Design Dk 6.4), allow designers to reduce circuit dimensions in applications where size and cost are critical. They are the best value choice for engineers working on designs including power amplifiers, patch antennas, ground-based radar, and other general RF applications.

 

Features and benefits:

1. Thermoset resin system specially formulated to meet 6.15 Dk

1). Ease of fabrication / processes similar to FR-4

2). Material repeatability

3). Low loss

4). High thermal conductivity

5). Lower total PCB cost solution than competing PTFE products,

 

2. Low Z-axis CTE / High Tg

1). Design flexibility

2). Plated through-hole reliability

3). Automated assembly compatible

 

3. Environmentally friendly

1.) Lead free process compatible

 

4. Regional finished goods inventory

1). Short lead times / quick inventory turns

2). Efficient supply chain

 

 

Some Typical Applications:

1. Base Station Power Amplifiers

2. Small Cell Transceivers

3. Patch antennas

4. Ground-based Radar

 

 

PCB Capability (RO4360G2)

PCB Material:Hydrocarbon Ceramic-filled Thermoset Materials
Designation:RO4360G2
Dielectric constant:6.15 ±0.15
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP etc..

 

 

Data Sheet of RO4360G2

RO4360G2 Typical Value
PropertyRO4360G2DirectionUnitsConditionTest Method
Dielectric Constant,εProcess6.15±0.15Z 10 GHz/23IPC-TM-650 2.5.5.5
2.5 GHz/23
Dissipation Factor,tanδ0.0038Z 10 GHz/23IPC-TM-650 2.5.5.5
Thermal Conductivity0.75 W/mK50ASTM D-5470
Volume Resistivity4.0 X 1013 Ω.cmElevated TIPC-TM-650 2.5.17.1
Surface Resistivity9.0 X 1012 ΩElevated TIPC-TM-650 2.5.17.1
Electrical Strength784ZV/mil IPC-TM-650 2.5.6.2
Tensile Strength131 (19) 97(14)X YMPa (kpsi)40 hrs 50%RH/23ASTM D638
Flexural Strength213(31) 145(21)X YMpa (kpsi)40 hrs 50%RH/23IPC-TM-650, 2.4.4
Coefficient of Thermal Expansion13 14 28X Y Zppm/-50 to 288 After Replicated Heat CycleIPC-TM-650, 2.1.41
Tg>280 ℃ TMA IPC-TM-650 2.4.24.3
Td407  ASTM D3850 using TGA
T288>30Zmin30 min / 125 PrebakeIPC-TM-650 2.2.24.1
Moisure Absorption0.08 %50/48hrIPC-TM-650 2.6.2.1 ASTM D570
Thermal Coefficient of er-131 @10 GHzZppm/℃-50 to 150 IPC-TM-650, 2.5.5.5
Density2.16 gm/cm3RTASTM D792
Copper Peel Stength5.2 (0.91) pli (N/mm)Condtion BIPC-TM-650 2.4.8
FlammabilityV-0   UL 94 File QMTS2. E102765

 

 

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