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4 Layer Hybrid PCB With RO4003C + FR4 Combined High Frequency PCB

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Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China

Contact name:Sally Mao

Shenzhen Bicheng Electronics Technology Co., Ltd

4 Layer Hybrid PCB With RO4003C + FR4 Combined High Frequency PCB

Country/Region	china
City & Province	shenzhen guangdong
Categories	Solar Chargers

Product Details

4 Layer Hybrid PCB With RO4003C + FR4 Combined

(PCB’s are custom-made products, the picture and parameters shown are just for reference)

General description

This is a type of high frequency PCB built on RO4003C and FR4 combined for the application of analogue transmitter. It's a 4 layer RF PCB board at 1.1 mm thick. It's immersion silver finish with blue solder mask and white silkscreen. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 boards are packed for shipment.

Features and benefits

The characteristic of low dielectric loss makes the signal loss at a lower level, which makes the signal transmission of the whole equipment excellent.

Stable electrical coefficient of dielectric constant.

Delamination of copper foil will not be caused by the change of cold and heat due to the consistency with the thermal expansion coefficient of copper foil.

Immersion gold has excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.

PCB manufacturing is strictly as per required specifications.

Meeting your printed circuit board needs from PCB prototyping to mass volume production.

Reduce manufacturing cost from advanced equipment import, worker training and technology improvement and management.

International approvals

RoHS materials

Application

Uhf radio, Directional coupler, Analogue transmitter, Base station antenna

Parameter and data sheet

PCB SIZE	70 x 12mm=1PCS
BOARD TYPE	Hybrid PCB
Number of Layers	Multilayer PCB, 4 layer PCB
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- 35um(1oz)+plate TOP layer
	RO4003C 0.203mm (8 mil)
	copper ------- 35um(1oz) MidLayer 1
	FR-4 0.50 mm
	copper ------- 35um(1oz) MidLayer 2
	FR-4 0.20 mm
	copper ------- 17um(0.5oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	5 mil / 6 mil
Minimum / Maximum Holes:	0.3/5.5 mm
Number of Different Holes:	8
Number of Drill Holes:	97
Number of Milled Slots:	0
Number of Internal Cutouts:	1
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	RO4003C 0.203 mm (8 mil) and FR-4 0.20 mm combined
Final foil external:	1oz
Final foil internal:	1oz
Final height of PCB:	1.1mm ±0.11
PLATING AND COATING
Surface Finish	Immersion Silver
Solder Mask Apply To:	Top and Bottom side
Solder Mask Color:	Blue, KSM-6189BL04/KSM-19H01
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	Top
Colour of Component Legend	White
Manufacturer Name or Logo:	N/A
VIA	Plated through hole(PTH), via open
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.