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9oz Heavy Copper Aluminum PCB for High Current Application

Shenzhen Bicheng Electronics Technology Co., Ltd
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Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China

Contact name:Sally Mao

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Shenzhen Bicheng Electronics Technology Co., Ltd

9oz Heavy Copper Aluminum PCB for High Current Application

Country/Region china
City & Province shenzhen guangdong
Categories Terminal Blocks
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Product Details

Product profile

 

 

1.1 General description

 

This is a type of heavy copper single sided aluminum PCB board at 1.2mm thick

for the application of high current and high temperature dissipation. The base

laminate is from ITEQ 9oz Copper. It's fabricated per IPC 6012 Class 2 using

supplied Gerber data. Each 20 panel boards are packed separately.

 


1.2 Features and benifits


A. Optimization combination of power circuit and control circuit,
B. Replace the fragile ceramic substrate and obtain a better mechanical durability,
C. Effective heat diffusion in the design of the circuit,
D. Reduce the operating temperature of the equipment,
E. Improve the power density and reliability of the device,
F. Prolong the service life of the product,
G. High voltage test, Impedance control test, micro-section, solder-ability test,
H. Strict WIP inspection and monitoring as well as working instruction,
I. Right manufacturing instruction (MI),
J. Great customer service
K. UL conformed
L. Professional and experienced engineers

 

 

1.3 Application


Industrial and mining lamps,Automotive ignitor,Security system,audio amplifier

 


1.4 Parameter and data sheet

Number of Layers1
Board TypeSingle Sided PCB
Board Thickness1.20 mm +/-0.1
Board MaterialAluminum PCB, MCPCB
Board Material SupplierITEQ
Tg Value of Board Material150℃
 
PTH Cu thicknessN/A
Inner Iayer Cu thicknesN/A
Surface Cu thickness315 um (9oz)
 
Solder Mask Type and Model No.N/A
Solder Mask SupplierN/A
Solder Mask ColourN/A
Number of Solder MasksN/A
Thickness of Solder MaskN/A
 
Type of Silkscreen InkN/A
Supplier of SilkscreenN/A
Color of SilkscreenN/A
Number of SilkscreenN/A
 
Mininum Trace (mil)16 mil
Minimum Gap(mil)14.7 mil
 
Surface FinishOSP
RoHS RequiredYes
Warpage0.14%
 
Thermal Shock Test

Pass, 288±5℃,10 seconds, 3 cycles.

No delamination, no blistering.

Solderablity TestPass, 255±5℃,5 seconds Wetting Area Least 95%
Function100% Pass electrical test
WorkmanshipCompliance with IPC-A-600H & IPC-6012C Class 2

 

 

1.5 Outline dimension Unit: mm

NO.Required Dimension (toerance)Actual dimension
185.00±0.1584.9985.0185.0085.01
267.00±0.1567.0267.0167.0066.99

 

 

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