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High Temperature PCB on FR-4 with 8 Layers Copper Track with green soldermask and Immersion Gold

Shenzhen Bicheng Electronics Technology Co., Ltd
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Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China

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Shenzhen Bicheng Electronics Technology Co., Ltd

High Temperature PCB on FR-4 with 8 Layers Copper Track with green soldermask and Immersion Gold

Country/Region china
City & Province shenzhen guangdong
Categories Electronics Production Machinery
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Product Details

Product profile

 

 

1.1 General description


This is a type of 8 layer printed circuit board built on FR-4 Tg180 substrate

for the application of Satellite Radio. It's 1.6 mm thick with white silkscreen

(Taiyo) on green solder mask (Taiyo) and immersion gold on pads. The base

material is from Taiwan ITEQ supplying 1 up PCB per panel. They're fabricated

per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are packed

for shipment.

 

 

1.2 Features and benifits

A. RoHS compliant and suitable for high thermal reliability needs
B. High solderability, no stressing of circuit boards and less contamination of

     PCB surface.
C. Delivery on time. Higher than 98% on-time-delivery rate.
D. 30000 square meter month capability
E. More than 15 years of experience
F.  Volume Production capability

 


1.3 Application

WiFi Range Extender, CCTV System, Satellite Communication, 3G Speed,

Router WiFi 3G, Solar Panel Inverter, GPS Tracking Systems, Embedded

Processor, PLC Programs, Phone systems

 


1.4 Parameter and data sheet

PCB SIZE215 x 212mm=1PCS
BOARD TYPEMultilayer PCB
Number of Layers8 layers
Surface Mount ComponentsYES
Through Hole ComponentsYES
LAYER STACKUPcopper ------- 18um(0.5oz)+plate TOP layer
Prepreg 7628(43%) 0.195mm
copper ------- 35um(1oz) MidLayer 1
FR-4 0.2mm
copper ------- 35um(1oz) MidLayer 2
Prepreg 7628(43%) 0.195mm
copper ------- 35um(1oz) MidLayer 3
FR-4 0.2mm
copper ------- 35um(1oz) MidLayer 4
Prepreg 7628(43%) 0.195mm
copper ------- 35um(1oz) MidLayer 5
FR-4 0.2mm
copper ------- 35um(1oz) MidLayer 6
Prepreg 7628(43%) 0.195mm
copper ------- 18um(0.5oz)+plate BOT Layer
TECHNOLOGY 
Minimum Trace and Space:4mil/4mil
Minimum / Maximum Holes:0.3/3.2mm
Number of Different Holes:18
Number of Drill Holes:11584
Number of Milled Slots:2
Number of Internal Cutouts:0
Impedance Control:no
Number of Gold finger:0
BOARD MATERIAL 
Glass Epoxy:FR-4 TG170℃, er<5.4.IT-180, ITEQ Supplied
Final foil external:1oz
Final foil internal:1oz
Final height of PCB:1.6mm ±0.16
PLATING AND COATING 
Surface FinishImmersion gold (32.1% ) 0.05µm over 3µm nickel
Solder Mask Apply To:TOP and Bottom, 12micron Minimum
Solder Mask Color:Green, PSR-2000 KX700G, Taiyo Supplied.
Solder Mask Type:LPSM
CONTOUR/CUTTINGRouting, stamp holes.
MARKING 
Side of Component LegendTOP and Bottom.
Colour of Component LegendWhite, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:Marked on the board in a conductor and leged FREE AREA
VIAplated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE 
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

 

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