Active Member
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[China]
Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Contact name:Sally Mao
Shenzhen Bicheng Electronics Technology Co., Ltd |
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Product profile
1.1 General description
This is a type of heavy copper single sided aluminum PCB board at 1.2mm thick for
the application of high current and high temperature dissipation. The base laminate
is from ITEQ 9oz Copper. It's fabricated per IPC 6012 Class 2 using supplied Gerber
data. Each 20 panel boards are packed separately.
1.2 Features and benifits
A. Optimization combination of power circuit and control circuit,
B. Replace the fragile ceramic substrate and obtain a better
mechanical durability,
C. Effective heat diffusion in the design of the circuit,
D. Reduce the operating temperature of the equipment,
E. Improve the power density and reliability of the device,
F. Prolong the service life of the product,
G. Whole fabrication process are totally controlled.
H. 100% tests inclusive of electrical test and AOI inspection.
I. Thermal stress test, reliability test, insulation
resistance test and ionic contamination
test
J. RoHS materials
K. Focus on low to medium volume production
L. Small quantity order is accepted
1.3 Application
Downlight, Automatic safety control system, DC/AC converter, power amplifier
1.4 Parameter and data sheet
| Number of Layers | 1 |
| Board Type | Single Sided PCB |
| Board Thickness | 1.20 mm +/-0.1 |
| Board Material | Aluminum PCB, MCPCB |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 150℃ |
| PTH Cu thickness | N/A |
| Inner Iayer Cu thicknes | N/A |
| Surface Cu thickness | 280 um (8 oz) |
| Solder Mask Type and Model No. | N/A |
| Solder Mask Supplier | N/A |
| Solder Mask Colour | N/A |
| Number of Solder Masks | N/A |
| Thickness of Solder Mask | N/A |
| Type of Silkscreen Ink | N/A |
| Supplier of Silkscreen | N/A |
| Color of Silkscreen | N/A |
| Number of Silkscreen | N/A |
| Mininum Trace (mil) | 16 mil |
| Minimum Gap(mil) | 14.7 mil |
| Surface Finish | OSP |
| RoHS Required | Yes |
| Warpage | 0.14% |
| Thermal Shock Test | Pass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Solderablity Test | Pass, 255±5℃,5 seconds Wetting Area Least 95% |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6012C Class 2 |
1.5 Outline dimension Unit: mm
| NO. | Required Dimension (toerance) | Actual dimension | ||||
| 1 | 81.00 | ±0.15 | 81.99 | 81.01 | 81.00 | 81.01 |
| 2 | 65.00 | ±0.15 | 65.02 | 65.01 | 65.00 | 64.99 |
Pattern plating
