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RF-60A PCB 31mil (0.80mm) Taconic Double Layer RF PCB With Immersion Gold For Antennas

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Shenzhen Bicheng Electronics Technology Co., Ltd

RF-60A PCB 31mil (0.80mm) Taconic Double Layer RF PCB With Immersion Gold For Antennas

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Product Details

RF-60A 31mil (0.80mm) Taconic Double Layer RF PCB With Immersion Gold For Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RF-60A is an organic-ceramic laminate in the ORganic CERamic(ORCER) family of Taconic products. It's based on woven glass reinforcement. It is a result of Taconic's expertise in both ceramic fill technology and in coated PTFE fiberglass. RF-60A exhibits exceptional interlaminar bond strength and solder resistance. Its proprietary composition results in low moisture absorption and uniform electrical properties.

 

 

RF-60A's woven glass reinforcement ensures excellent dimentional stability and enhances flexural strength. It exhibits low Z-axis expansion allowing for plated-through-hole reliablity in extreme thermal environments. With a dielectric constant of approximately 6.15, it is ideal high DK products for applications requiring reduced circuit size and weight. The low electrical loss factor makes it an excellent selection for RF circuits.

 

 

RF-60A laminates are in complete compliance with RoHS and WEEE directives and are compatible with the temperatures required for the new lead free solders. They can be sheared, drilled, milled and plated using standard methods for PTFE-woven fiberglass materials, so mass production becomes possible.

 

 

 

Our PCB Capabilities (RF-60A)

PCB Material:Organic-ceramic Woven Fiberglass Reinforced Laminates
Designation:RF-60A
Dielectric constant:6.15 ±0.25
Dissipation FactorDF 0.0038@10 GHz
Thermal Conductivity0.4 W/MK
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil (0.254mm), 25mil (0.635mm), 31mil (0.787mm), 50mil (1.27mm), 60mil (1.524mm), 125mil (3.175mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP, Immersion tin etc..

 

Benefits (in general):

Low Moisture Absorption

Stable DK over Frequency

Dimensionally Stable

Low Z-axis Expansion

High Flexural Strength

Exceptional Interlaminar Bonds

 

Typical Applications:

Power Amplifiers

Filters & Couplers

Passive Components

Antennas

 

 

Data Sheet of Taconic RF-60A

PropertyTest MethodUnitValueUnitValue
Dk @ 10 GHzIPC-650 2.5.5.6 6.15 6.15
Df @ 10 GHzIPC-650 2.5.5.5.1 0.0038 0.0038
Moisture AbsorptionIPC-650 2.6.2.1%0.02%0.02
Dielectric BreakdownIPC-650 2.5.6kV53kV53
Dielectric StrengthASTM D 149V/mil880kV/mm35
Volume ResistivityIPC-650 2.5.17.1 (After Humidity)Mohm/cm9.0 x 108Mohm/cm9.0 x 108
Surface ResistivityIPC-650 2.5.17.1 (After Humidity)Mohm2.28 x 108Mohm2.28 x 108
Arc ResistanceIPC-650 2.5.1Seconds193Seconds193
Flexural Strength (MD)ASTM D 790psi18,300N/mm2126.2
Flexural Strength (CD)ASTM D 790psi14,600N/mm2100.7
Tensile Strength (MD)ASTM D 3039psi19,500N/mm2134.4
Tensile Strength (CD)ASTM D 3039psi16,300N/mm2112.4
Young’s ModulusASTM D 3039kpsi1,590N/mm211,000
Poisson’s RatioASTM D 3039 0.068N/mm20.068
Compressive ModulusASTM D 695 (23°C)kpsi338 2,330
Peel Strength (1 oz. ED)IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress)lbs/in8N/mm1.4
Dimensional Stability (MD)IPC-650 2.4.39 Sec. 5.4 (After Bake)mils/in0.68mm/M0.68
Dimensional Stability (CD)IPC-650 2.4.39 Sec. 5.4 (After Bake)mils/in1.05mm/M1.05
Density (Specific Gravity)ASTM D 792g/cm32.79g/cm32.79
Thermal ConductivityASTM F 433W/M*K0.4W/M*K0.4
CTE (X axis)ASTM D 3386 (-30°C - 125°C)ppm/°C9ppm/°C9
CTE (Y axis)ASTM D 3386 (-30°C - 125°C)ppm/°C8ppm/°C8
CTE (Z axis)ASTM D 3386 (-30°C - 125°C)ppm/°C69ppm/°C69
Outgassing (% TML)ASTM E 595*%0.02%0.02
Outgassing (% CVCM)ASTM E 595*%0.00%0.00
Outgassing (% WVR)ASTM E 595*%0.01%0.01
Flammability RatingUL 94 V-0 V-0

 

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