Active Member
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[China]
Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Contact name:Sally Mao
Shenzhen Bicheng Electronics Technology Co., Ltd |
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Product profile
1.1 General description
This is a type of flexible printed circuit for the application of analog device. It’s a
2 layer board at 0.15mm thick. The base laminate is from ITEQ, It's fabricated
per IPC 6012 Class 2 using supplied Gerber data. Immersion gold is applied
on the pads. Stiffner is applied on the connector part.
1.2 Features and benifits
A. Excellent flexibility
B. Reducing the volume
C. Weight reduction
D. Consistency of assembly
E. Increased reliability
F. Controllability of electrical parameter design
G. The end can be whole soldered
H. Material optionality
I. Low cost
J. Continuity of processing
K. Focus on low to medium volume production
L. High technology
1.3 Application
Thin-film switch, mobile phone antenna flex board, automobile GPS navigation
flex board
1.4 Parameter and data sheet
| Number of Layers | 2 |
| Board Type | Flexbile cirucit |
| Board Thickness | 0.15mm +/-10% |
| Board Material | Polyimide (PI) 25um |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 60℃ |
| PTH Cu thickness | ≥20 um |
| Inner Iayer Cu thicknes | N/A |
| Surface Cu thickness | 35 um (1oz) |
| Coverlay Colour | Yellow |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 um |
| Stiffener | 200 um |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 2 |
| Mininum Trace (mil) | 4 mil |
| Minimum Gap(mil) | 4 mil |
| Surface Finish | Immersion Gold |
| RoHS Required | Yes |
| Famability | 94-V0 |
| Thermal Shock Test | Pass, -25℃±125℃, 1000 cycles. |
| Thermal Stress | Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
1.5 Microsection Hole Wall (um)
| Hole Wall Cu Thickness | ≥20 um | Hole Wall Cu Roughness | ≤25.4 um | ||||
| NO. | A | B | C | D | E | F | AVE |
| 1 | 22.310 | 22.150 | 22.320 | 22.150 | 22.350 | 22.150 | 22.238 |
1.6 Outline dimension Unit: mm
| NO. | Required Dimension (toerance) | Actual dimension | ||||
| 1 | 110.00 | ±0.13 | 110.12 | 110.01 | 110.09 | 110.08 |
| 2 | 145.00 | ±0.13 | 145.01 | 145.15 | 145.12 | 145.02 |
1.7 Hole Size and Slot Dimension (mm)
| NO. | Requerment Dimension (tolerance) | PTH/NPT | Actual dimension | ||||
| 1 | 0.300 | ±0.075 | Y | via | via | via | via |
| 2 | 0.400 | ±0.075 | Y | via | via | via | via |
| 3 | 0.610 | ±0.075 | Y | via | via | via | via |
