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Rogers High Frequency PCB Built on 20mil 0.508mm RO4350B With Immersion Gold and Green Mask for Splitter

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Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China

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Shenzhen Bicheng Electronics Technology Co., Ltd

Rogers High Frequency PCB Built on 20mil 0.508mm RO4350B With Immersion Gold and Green Mask for Splitter

Country/Region china
City & Province shenzhen guangdong
Categories Other Wires, Cables & Cable Assemblies
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Product Details

High Frequency PCB Rogers 20mil 0.508mm RO4350B Double Sided RF PCB for Splitter

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

PCB parameter

PCB SIZE26 x 83mm=1PCS
BOARD TYPE 
Number of LayersDouble sided PCB, 2 Layer PCB
Surface Mount ComponentsYES
Through Hole Componentsno
LAYER STACKUPcopper ------- 35um(1oz)+plate TOP layer
RO4350B 20mil (0.508mm)
copper ------- 35um(1oz)+plate BOT Layer
TECHNOLOGY 
Minimum Trace and Space:5.98mil/6.18mil
Minimum / Maximum Holes:0.3/3.2mm
Number of Different Holes:5
Number of Drill Holes:431
Number of Milled Slots:0
Number of Internal Cutouts:no
Impedance Controlno
BOARD MATERIAL 
Glass Epoxy:RO4350B 20mil (0.508mm), Tg 288℃
Final foil external:1.5oz
Final foil internal:0oz
Final height of PCB:0.6mm ±0.1
PLATING AND COATING 
Surface FinishImmersion Gold (81.1%) 2µ" over 100µ" nickel
Solder Mask Apply To:Top and Bottom, 12micron Minimum
Solder Mask Color:Green, LP-4G G-05, Nanya supplied
Solder Mask Type:LPSM
CONTOUR/CUTTINGRouting
MARKING 
Side of Component LegendTOP
Colour of Component LegendWhite, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:Marked on the board in a conductor and leged FREE AREA
VIAPlated Through Hole(PTH)
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE 
Outline dimension:0.0059" (0.15mm)
Board plating:0.0030" (0.076mm)
Drill tolerance:0.002" (0.05mm)
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

 

Advantages

1. RO4350B substrate. Excellent high frequency performance due to low dielectric tolerance and loss.

2. Stable electrical coefficient of dielectric constant.

3. PCB manufacturing on required specifications. Right manufacturing instruction (MI), comprehensive       equipment management and maintenance and process control, strict WIP inspection and monitoring as     well as working instruction, all those make the whole fabrication process totally controlled.

4. Meeting your printed circuit board needs from PCB prototyping to mass volume production.

 

Appendix: Data sheet of RO4350B

RO4350B Typical Value
PropertyRO4350BDirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.48±0.05Z 10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.66Z 8 to 40 GHzDifferential Phase Length Method
Dissipation Factortan,δ0.0037
0.0031
Z 10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε+50Zppm/℃-50℃to 150℃IPC-TM-650 2.5.5.5
Volume Resistivity1.2 x 1010 MΩ.cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity5.7 x109 COND AIPC-TM-650 2.5.17.1
Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
Tensile Modulus16,767(2,432)
14,153(2,053)
X
Y
MPa(ksi)RTASTM D 638
Tensile Strength203(29.5)
130(18.9)
X
Y
MPa(ksi)RTASTM D 638
Flexural Strength255
(37)
 MPa
(kpsi)
 IPC-TM-650 2.4.4
Dimensional Stability<0.5X,Ymm/m
(mil/inch)
after etch+E2/150℃IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion10
12
32
X
Y
Z
ppm/℃-55℃to288℃IPC-TM-650 2.4.41
Tg>280 ℃ TMAAIPC-TM-650 2.4.24.3
Td390 ℃ TGA ASTM D 3850
Thermal Conductivity0.69 W/M/oK80℃ASTM C518
Moisture Absorption0.06 %48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density1.86 gm/cm323℃ASTM D 792
Copper Peel Stength0.88
(5.0)
 N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability(3)V-0   UL 94
Lead-free Process CompatibleYes    

 

 

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