HIP4080AIBZ 80V/2.5A Peak , High Frequency Full Bridge FET Driver digital integrated circuits

HIP4080AIBZ 80V/2.5A Peak, High Frequency Full Bridge FET Driver

Features

• Drives N-Channel FET Full Bridge Including High Side Chop Capability 
• Bootstrap Supply Max Voltage to 95VDC
• Drives 1000pF Load at 1MHz in Free Air at +50°C with Rise and Fall Times of Typically 10ns
• User-Programmable Dead Time
• Charge-Pump and Bootstrap Maintain Upper Bias Supplies
• DIS (Disable) Pin Pulls Gates Low
• Input Logic Thresholds Compatible with 5V to 15V Logic Levels
• Very Low Power Consumption
• Undervoltage Protection
• Pb-Free Available as an Option

Applications

• Medium/Large Voice Coil Motors
• Full Bridge Power Supplies
• Switching Power Amplifiers
• High Performance Motor Controls
• Noise Cancellation Systems
• Battery Powered Vehicles
• Peripherals
• U.P.S

Absolute Maximum Ratings
Supply Voltage, VDD and VCC. . . . . . . . . . . . . . . . . . . . -0.3V to 16V
Logic I/O Voltages . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VDD +0.3V
Voltage on AHS, BHS . . . -6.0V (Transient) to 80V (25°C to 125°C)
Voltage on AHS, BHS . . . -6.0V (Transient) to 70V (-55°C to 125°C)
Voltage on ALS, BLS . . . . . . . -2.0V (Transient) to +2.0V (Transient)
oltage on AHB, BHB . . . . . . VAHS, BHS -0.3V to VAHS, BHS +VDD
Voltage on ALO, BLO. . . . . . . . . . . . .VALS, BLS -0.3V to VCC +0.3V
Voltage on AHO, BHO . . . . . . VAHS, BHS -0.3V to VAHB, BHB +0.3V
Input Current, HDEL and LDEL . . . . . . . . . . . . . . . . . . -5mA to 0mA
Phase Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V/ns
All Voltages relative to VSS, unless otherwise specified.
Operating Conditions

Supply Voltage, VDD and VCC. . . . . . . . . . . . . . . . . . +9.5V to +15V
Voltage on ALS, BLS . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to +1.0V
Voltage on AHB, BHB . . . . . . . .VAHS, BHS +5V to VAHS, BHS +15V
Input Current, HDEL and LDEL . . . . . . . . . . . . . . . .-500µA to -50µA
Operating Ambient Temperature Range . . . . . . . . . .-40°C to +85°C
Thermal Information
Thermal Resistance (Typical, Note 3) θJA (°C/W)
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Maximum Power Dissipation at +85°C
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .470mW
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .530mW
Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C
Operating Max. Junction Temperature. . . . . . . . . . . . . . . . . . +125°C
Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . . +300°C
(For SOIC - Lead Tips Only)




 

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