Ir2132s Integrated Circuit Chip Power Mosfet 3-Phase Bridge Driver

IR2130/IR2132(J)(S) & (PbF)

3-PHASE BRIDGE DRIVER

Features

• Floating channel designed for bootstrap operation Fully operational to +600V Tolerant to negative transient voltage dV/dt immune

• Gate drive supply range from 10 to 20V

• Undervoltage lockout for all channels

• Over-current shutdown turns off all six drivers

• Independent half-bridge drivers

• Matched propagation delay for all channels

• 2.5V logic compatible

• Outputs out of phase with inputs

• Cross-conduction prevention logic

• Also available LEAD-FREE

Description

The IR2130/IR2132(J)(S) is a high voltage, high speed power MOSFET and IGBT driver with three independent high and low side referenced output channels. Proprietary HVIC technology enables ruggedized monolithic construction. Logic inputs are compatible with CMOS or LSTTL outputs, down to 2.5V logic. A ground-referenced operational amplifier provides analog feedback of bridge current via an external current sense resistor.

A current trip function which terminates all six outputs is also derived from this resistor. An open drain FAULT signal indicates if an over-current or undervoltage shutdown has occurred. The output drivers feature a high pulse current buffer stage designed for minimum driver cross-conduction. Propagation delays are matched to simplify use at high frequencies. The floating channels can be used to drive N-channel power MOSFETs or IGBTs in the high side configuration which operate up to 600 volts.

Product Summary

V_OFFSET                 600V max.

 I_O+/-                   200 mA / 420 mA

  V_OUT                      10 - 20V

t_on/off (typ.)             675 & 425 ns

Deadtime (typ.)      2.5 µs (IR2130)

                              0.8 µs (IR2132)

Absolute Maximum Ratings

Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to V_S0. The Thermal Resistance and Power Dissipation ratings are measured under board mounted and still air conditions. Additional information is shown in Figures 50 through 53.

Packages

Stock Offer (Hot Sell)