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SN74LS373N Electronic IC Chips popular integrated circuits

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Anterwell Technology Ltd.

SN74LS373N Electronic IC Chips popular integrated circuits

Country/Region china
City & Province shenzhen guangdong
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Product Details

 

SN54LS373, SN54LS374, SN54S373, SN54S374, SN74LS373, SN74LS374, SN74S373, SN74S374

OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS

 

  • Choice of Eight Latches or Eight D-Type Flip-Flops in a Single Package
  • 3-State Bus-Driving Outputs
  • Full Parallel Access for Loading
  • Buffered Control Inputs
  • Clock-Enable Input Has Hysteresis to Improve Noise Rejection (’S373 and ’S374)
  • P-N-P Inputs Reduce DC Loading on Data Lines (’S373 and ’S374)

 

description

These 8-bit registers feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. The high-impedance 3-state and increased high-logic-level drive provide these registers with the capability of being connected directly to and driving the bus lines in a bus-organized system without need for interface or pullup components. These devices are particularly attractive for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

 

The eight latches of the ’LS373 and ’S373 are transparent D-type latches, meaning that while the enable (C or CLK) input is high, the Q outputs follow the data (D) inputs. When C or CLK is taken low, the output is latched at the level of the data that was set up.

 

The eight flip-flops of the ’LS374 and ’S374 are edge-triggered D-type flip-flops. On the positive transition of the clock, the Q outputs are set to the logic states that were set up at the D inputs.

 

Schmitt-trigger buffered inputs at the enable/clock lines of the ’S373 and ’S374 devices simplify system design as ac and dc noise rejection is improved by typically 400 mV due to the input hysteresis. A buffered output-control (OC) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly.

 

OC does not affect the internal operation of the latches or flip-flops. That is, the old data can be retained or new data can be entered, even while the outputs are off.

 

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† (’LS devices)

 

Supply voltage, VCC (see Note 1)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V

Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V

Off-state output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V

Package thermal impedance, θJA (see Note 2): DB package  . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W

                                                                          DW package . . . . . . . . . . . . . . . . . . . . . . . . .58°C/W

                                                                          N package  . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W

                                                                          NS package  . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W

Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C

                                                                                                                                                              

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. Voltage values are with respect to network ground terminal.

               2. The package thermal impedance is calculated in accordance with JESD 51-7.

 

 

 

 

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