Active Member
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[China]
Address: Room 36B1-B2, Building C, Electronics Science & Technology Building Shennan Mid-Road, Shenzhen China
Contact name:Sharon Yang
Anterwell Technology Ltd. |
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| ZTX757 | 4500 | ZETEX | 11+ | TO-92 |
| L78L15ACD13TR | 10000 | ST | 15+ | SOP8 |
| PM30RHC060 | 120 | MITSUBISH | 11+ | MOUDLE |
| M24C02-WBN6 | 4647 | ST | 16+ | DIP |
| ZXMP6A13FTA | 9200 | DIODES | 15+ | SOT23 |
| MC14516BCP | 5798 | ON | 16+ | DIP |
| MC14106BCP | 6680 | ON | 16+ | DIP |
| QM200HA-2H | 230 | MITSUBISH | 13+ | MODULE |
| MJ11016 | 2089 | ON | 16+ | TO-3 |
| MC33388DR2 | 9416 | FREESCALE | 16+ | SOP |
| LM321M5X | 6229 | NSC | 14+ | SOT23-5 |
| MBRS190T3G | 40000 | ON | 16+ | SMB |
| L6599D | 3510 | ST | 15+ | SOP-16 |
| LA7847 | 3356 | SANYO | 15+ | ZIP |
| LA4224 | 3708 | SANYO | 14+ | DIP8 |
| BT136-500 | 10000 | NXP | 14+ | TO220 |
| 36MB100A | 1629 | IR | 15+ | MODULE |
| LM2674MX-5.0 | 1865 | NSC | 10+ | SOP-8 |
| LTC1690CS8 | 6022 | LINEAR | 14+ | SOP |
| PMBT3904 | 780000 | NXP | 15+ | SOT-23 |
| PM10CNA060 | 200 | MITSUBISH | 09+ | MOUDLE |
| B1240 | 3455 | ON | 15+ | DIP18 |
| LM3403N | 2969 | NSC | 10+ | DIP-14 |
| LM4050CIM3X-2.5 | 6586 | NSC | 13+ | SOT-23-3 |
| PIC16LF877A-I/PT | 4698 | MICROCHIP | 16+ | QFP |
| MAX4252EUA | 13500 | MAXIM | 15+ | MSOP |
| MC33033DW | 11000 | ON | 16+ | SOP |
| L05172 | 1596 | ST | 15+ | HSSOP36 |
| BT136S-600E | 3829 | NXP | 15+ | TO220 |
| MCP6S21-I/MS | 5560 | MICROCHIP | 16+ | MSOP |
| MTD1375F | 7513 | SHINDENGE | 15+ | HSOP |
| MAX3232ECAE | 11250 | MAXIM | 16+ | SSOP |
| MD1803DFX | 5836 | ST | 16+ | TO-3P |
| LM5118MH | 1743 | NSC | 11+ | TSSOP-20 |
| LTC3108IGN | 6857 | LT | 16+ | SSOP |
| ATTINY26L-8MU | 552 | ATMEL | 14+ | QFN-32 |
| ZRA245A02 | 1200 | ZETEX | 10+ | TO-92 |
| LP3855ESX-3.3 | 2263 | NSC | 14+ | TO-263 |
| PIC18F25J10-I/SO | 4558 | MICROCHIP | 15+ | SOP |
| AU6254 | 3000 | ALCOR | 12+ | LQFP48 |
| MJE15032G+MJE15033G | 62000 | ON | 14+ | TO-220 |
| LM6172IMX | 2584 | NSC | 14+ | SOP-8 |
| MMPQ3904 | 4944 | ON | 10+ | SOP-16 |
| MAX186AEPP | 715 | MAXIM | 15+ | DIP |
| OP270GP | 6040 | AD | 16+ | DIP |
FEATURES
· Plastic package has underwrites laboratory Flammability Classification 94V-0
· Glass passivated chip junction
· Built-in strain relief,
· Suoer Fast switching speed for high efficiency
· High temperature soldering guaranteed: 260℃/10 seconds
MECHANICAL DATA
Case: JEDED DO-214AB transfer molded plastic
Terminals: Solder plated, solderable per MIL-STD-750
Method 2026
Polarity: Color band denotes cathode end
Weight: 0.007 ounce, 0.25 gram
