Active Member
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[China]
Address: Room 36B1-B2, Building C, Electronics Science & Technology Building Shennan Mid-Road, Shenzhen China
Contact name:Sharon Yang
Anterwell Technology Ltd. |
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A part of stock list
| CAP 0603 150PF 50V CL10C151JB8NNNC | 800000 | SAMSUNG | AC7502D |
| CAP 0603 180PF 50V CL10B181KB8NNNC | 800000 | SAMSUNG | AA20SEE |
| RES 0805 5K9 1% RC0805FR-075K9L | 500000 | YAGEO | 1606 |
| RES 0805 20K5 1% RC0805FR-0720K5 | 500000 | YAGEO | 1606 |
| C.I LNK623PG | 10000 | POWER | 1407 |
| C.I STM32F030K6T6 | 10000 | ST | 1549 |
| DIODO ES1J-E3/61T | 180000 | VISHAY | 1642/EJ |
| CAP 0603 10PF 50V NPO 5% CL10C100JB8NNNC | 400000 | SAMSUNG | CCBET1P |
| DIODO 1N5822 AMMO | 1000000 | MIC | 307260623445 |
| TRANS BF422 | 2000 | TOS | 5F |
| DIODO 1.5KE7.5CA-E3/4 | 5000 | VISHAY | 16+ |
| CONECTOR S3B-PH-SM4-TB(LF)(SN) | 3200 | JST | 15+ |
| CONEC. BM06B-SRSS-TB(LF)(SN) | 3000 | JST | 15+ |
| CONECTOR S4B-PH-SM4-TB(LF)(SN) | 9200 | JST | 2015.11 |
| C.I A2982SLWTR-T | 3100 | ALLEGRO | 1642 |
| OPTOACOPLADOR CNY74-4H | 1000 | VISHAY | V413H68 |
| DIODO S1G-E3/61T | 18000 | VISHAY | 1632/SG |
| CI ADS7866IDBVR | 2500 | TI | A66Y |
| CI MSP430F417IPMR | 2500 | TI | 69A2P1W |
| C.I MC14584BDR2G | 3000 | ON | PAC928 |
| C.I PIC12F508-I/SN | 1000 | MICROCHIP | 1624KC6 |
| C.I LM1117IMPX-3.3/NOPB | 2000 | TI | 4ARD/N05B |
Feature
ENVIRONMENTAL SPECIFICATIONS:
Operating Temperature: –55°C to 125°C.
Shock: MIL-STD-202, Method 213, Test Condition I
(100 G’s peak for 6 milliseconds). Vibration: MIL-STD-202, Method 201
(10–55 Hz, .06 in. total excursion). Salt Spray: MIL-STD-202, Method 101,
Test Condition B (48 hrs.). Insulation Resistance (After Opening):
MIL-STD-202, Method 302, (10,000 ohms minimum at 100 volts).
Thermal Shock: MIL-STD-202, Method 107, Test Condition B (–65 to 125°C).
Moisture Resistance: MIL-STD-202, Method 106, High Humidity (90-98 RH), Heat (65°).
PHYSICAL SPECIFICATIONS: Materials: Body:
Molded Thermoplastic Terminations: 100%
Tin Plated Copper(459 Series) 100%
Tin Plated Copper(460 Series)
Solderability: MIL-STD-202, Method 208.
