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W25Q32BVSIG Programming electronic components ic circuit board 1500mW Power Dissipation

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Anterwell Technology Ltd.

W25Q32BVSIG Programming electronic components ic circuit board 1500mW Power Dissipation

Country/Region china
City & Province shenzhen guangdong
Categories Switching Power Supply
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Product Details

 

W25Q32BVSIG Programming electronic components ic circuit board 1500mW Power Dissipation

 

1. GENERAL DESCRIPTION

The W25Q32BV (32M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down. The W25Q32BV array is organized into 16,384 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q32BV has 1,024 erasable sectors and 64 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.) The W25Q32BV supports the standard Serial Peripheral Interface (SPI), and a high performance Dual/Quad output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 104MHz are supported allowing equivalent clock rates of 208MHz (104MHz x 2) for Dual I/O and 320MHz (80MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP (execute in place) operation. A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device identification with a 64-bit Unique Serial Number.

 

2. FEATURES

• Family of SpiFlash Memories – W25Q32BV: 32M-bit / 4M-byte (4,194,304) – 256-byte per programmable page – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3

• Highest Performance Serial Flash – 104MHz Dual SPI / 80MHz Quad SPI clocks – 208/320MHz equivalent Dual/Quad SPI – 40MB/S continuous data transfer rate – Up to 8X that of ordinary Serial Flash – More than 100,000 erase/program cycles(1) – More than 20-year data retention

• Efficient “Continuous Read Mode” – Low Instruction overhead – Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory – Allows true XIP (execute in place) operation – Outperforms X16 Parallel Flash

• Low Power, Wide Temperature Range – Single 2.7 to 3.6V supply

– 4mA active current, <1µA Power-down (typ.) – -40°C to +85°C operating range

• Flexible Architecture with 4KB sectors – Uniform Sector/Block Erase (4/32/64K-bytes) – Program one to 256 bytes – Erase/Program Suspend & Resume

• Advanced Security Features – Software and Hardware Write-Protect – Top/Bottom, 4KB complement array protection – Power Supply Lock-Down and OTP protection – 64-Bit Unique ID for each device – Discoverable Parameters (SFDP) Register – 3X256-Byte Security Registers with OTP locks – Volatile & Non-volatile Status Register Bits

• Space Efficient Packaging – 8-pin SOIC 208-mil – 8-pad WSON 6x5-mm/8x6-mm(2) – 16-pin SOIC 300-mil – 8-pin PDIP 300-mil – 24-ball TFBGA 8x6-mm – Contact Winbond for KGD and other options

 

3. PACKAGE TYPES AND PIN CONFIGURATIONS

W25Q32BV is offered in an 8-pin SOIC 208-mil (package code SS), an 8-pad WSON 6x5-mm or 8x6-mm (package code ZP & ZE), an 8-pin PDIP 300-mil (package code DA), a 16-pin SOIC 300-mil (package code SF) and a 24-ball 8x6-mm TFBGA (package code TC) as shown in Figure 1a-e respectively. Package diagrams and dimensions are illustrated at the end of this datasheet.

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