Active Member
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[China]
Address: Room 36B1-B2, Building C, Electronics Science & Technology Building Shennan Mid-Road, Shenzhen China
Contact name:Sharon Yang
Anterwell Technology Ltd. |
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HEXFET Power Mosfet Transistor , power mosfet module IRF7329
Trench Technology
Ultra Low On-Resistance
Dual P-Channel MOSFET
Low Profile (<1.8mm)
Available in Tape & Reel
Lead-Free
Description
New P-Channel HEXFET® power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The SO-8 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infrared, or wave soldering technique
| Parameter | Max. | Units | |
| VDS | Drain- Source Voltage | -12 | V |
| ID @ TA = 25°C | Continuous Drain Current, VGS @ -4.5V | -9.2 | A |
| ID @ TA= 70°C | Continuous Drain Current, VGS @ -4.5V -7.4 | -7.4 | |
| IDM | Pulsed Drain Current | -37 | |
| PD @TA = 25°C | Power Dissipation | 2.0 | W |
| PD @TA = 70°C | Power Dissipation | 1.3 | |
| Linear Derating Factor | 16 | mW/°C | |
| VGS | Gate-to-Source Voltage | ± 8.0 | V |
| TJ, TSTG | Junction and Storage Temperature Range | -55 to + 150 | °C |
