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MCU Board Flash Electronic IC Chip DP83869HMRGZT Surface Mount

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Yingxinyuan Int'l(Group) Ltd.

MCU Board Flash Electronic IC Chip DP83869HMRGZT Surface Mount

Country/Region china
City & Province shenzhen
Categories Connectors
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Product Details

MCU Board Chips Flash DP83869HMRGZT Electronic IC Chip

CategoriesIntegrated Circuits (ICs)
Features1/1 Transceiver - Ethernet 48-VQFN (7x7)
ManufacturerTexas Instruments
PackageReel - TR
Operating Temperature Range-40°C ~ 125°C (TA)
MountingSurface Mount
Package48-VFQFN Exposed Pad
Case / Package48-VQFN (7x7)
Family NameDP83869
MSL Level2 (1 Year)
REACH StatusREACH Unaffected
ECCN5A991B1
HTSUS8542.39.0001
Quantity per package250
Fake Threat In the Open Market57 pct.
PopularityMedium
Supply and Demand StatusLimited

 

Features

• Multiple Operating Modes

– Media Support: Copper and Fiber

– Media Conversion Between Copper and Fiber

– Bridge Between RGMII and SGMII

• Maximum Ambient Temperature of 125ºC

• Exceeds 8-kV IEC61000-4-2 ESD

• Low RGMII Latency

– Total Latency ≤ 384ns for 1000Base-T

– Total Latency ≤ 361ns for 100Base-TX

• Low Power Consumption

– < 150 mW for 1000Base-X

– < 500 mW for 1000Base-T

• Time Sensitive Network (TSN) Compliant • Recovered Clock Output for SyncE

• Selectable Synchronized Clock Output: 25 MHz and 125 MHz

• 1000Base-X, 100Base-FX Compatible With SFP MSA Specification

• IEEE1588 Support via SFD

• Wake On LAN Support

• Configurable IO Voltages: 1.8 V, 2.5 V, and 3.3 V

• SGMII, RGMII, MII MAC Interface

• Jumbo Frame Support for 1000M and 100M Speed

• Cable Diagnostics

– TDR

– BIST

• Programmable RGMII Termination Impedance

• Integrated MDI Termination Resistor

• Fast Link Drop modes

• Compatible to IEEE 802.3 1000Base-T, 100BaseTX, 10Base-Te,1000Base-X, 100Base-FX

 

Applications

 

• Industrial Factory Automation

• Grid Infrastructure

• Motor and Motion Control

• Test and Measurement

• Building Automation

 

Description

 

The DP83869HM device is a robust, fully-featured Gigabit Physical Layer (PHY) transceiver with integrated PMD sublayers that supports 10BASE-Te, 100BASE-TX and 1000BASE-T Ethernet protocols.

 

The DP83869 also supports 1000BASE-X and 100BASE-FX Fiber protocols. Optimized for ESD protection, the DP83869HM exceeds 8-kV IEC 61000-4-2 (direct contact).This device interfaces to the MAC layer through Reduced GMII (RGMII) and SGMII. In 100M mode, the device lets the designer use MII for lower Latency. Programmable integrated termination impedance on RGMII/MII helps reduce system BOM.

 

The DP83869HM supports Media Conversion in Managed mode. In this mode, the DP83869HM can run 1000BASE-X-to-1000BASE-T and 100BASE-FXto-100BASE-TX conversions. The DP83869HM can also support Bridge Conversion from RGMII to SGMII and SGMII to RGMII. The DP83869HM is compliant to TSN standards and offers low latency. 

 

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