Active Member
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[China]
Address: No.6 Haosi Western Industrial Park,Shajing Town,Bao'an District,Shenzhen,China
Contact name:Jane Yang
WDSbgamachine |
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What's the parameter of WDS-660?
Total Power | Max 6600W |
Upper Heating Power | 1200W |
Lower Heating Power | Second zone: 1200W, Third zone: IR 4200W |
Power Supply | (Single Phase)AC 110V/220V±10V 50Hz±3Hz 5.4 KVA |
Machine Dimension | L1200*W800*H900mm |
Positioning Way | V-shape card slot, PCB holder can be adjustable by X and Y axes |
Temperature Controlling | K-type thermocouple closed loop control, independent temperature control |
PCB Size(Max) | 500*500mm |
PCB Size (Min) | 10*10mm |
PCB Blowup Diploid | 2-50X |
Weight of machine | 110Kg |
Thermocouple Ports | 3units |
What's the unique specifications of WDS-660?
| 1. Touch screen interface and PLC controlling. display 3 temperature curves in any time. The temperature is controlled accurately between -1 degree and 1 degree. mobile phone repair software |
| 2. 6 segments controlling temperature, which could be controlled pre-heating, stillstand, heating, soldering 1, soldering 2 and cooling. The first-rate temperature controlling effectively ensure soldering effect. |
| 3. The machine could save 1-100 phases temperature curves. You could analyze curve and change setting at touch screen. |
| 4. There are 3 independent heating zones. The first and second heating zone could control the temperature in numerous phrases and the third heating zone pre-heating whole PCB so that achieve the best soldering effect. The temperature,time,slope,alarm are all displayed in the touch screen. |
| 5. Accurately inspect temperature by high accurate K-type thermocouple with closed loop control. External temperature measurement interface detect temperature accurately. |
| 6. Alarming after BGA was soldering and unsoldering. Circuit was interrupted automatically when the temperature is out of control which is double overtemperature protection function. |
| 7. Adopt high power cross-flow wind to cool the PCB board quickly, preventing the PCB board from deformation to ensure soldering effect. mobile phone repair software |
| 8. PCB board was located in "V" slot. The flexible and convenient universal fixture protect the PCB board. |
| 9. Touch screen control upside heating system and Optical alignment device system. Operation is convenient and flexible so that ensure alignment error within 0.01-0.02mm. |
| 10.Hot air head and mounting head 2 in 1 design, stepping motor drivers,auto-solder and unsolder function. Equipped with various BGA sizes muzzles so that easy to replace. And the same time special requirements can be customized. |
| 11. High precision optical vision system with optical image, fine adjustment and 15 inch color LCD monitor. |
| 12. High automatic avoid manual mistake. Reworking lead free and double BGA board will be accurate. mobile phone repair software |
