AZ-4 / J32, 8 * 15mm, Impinji Monza 3 Chip, Wet Inlay for security
access control
Chip:
Impinji Monza 3
Die Cut
Size:
12*24mm
Antenna
Size:
8*15mm
Reading Distance: 20CM
Frequency: 13.56MHz
Operating Temperature: -25°C to + 60°C
The card inlay is the half-finished card. We have the ability to
embed almost any kind of available Low Frequency and High Frequency
ICs and guarantees optimum mechanical and electrical performance.
On the Inlay(Prelaminates).
Application
ID card
Loyalty Program
Security / Access Control
Optional Information
- Payment : T/T
- Delivery : 7-10working days
- Origin : Shenzhen, Guangdong, China
- Minimum Order : 1000 sheets
- Packaging : 1000 in 1 Carton
Handling
- Inlays with ink marks are defective, do not use.
- RFID Inlays or labels are sensitive product, do not bend or stretch
- Static-free bag will be use for packing; always keep environmental
static charge to a minimum.
- Bancle RFID reserves the right to modify, change, supplement or
discontinue product offerings at any time without notice
- All products from Bancle RFID should be tested by the customer/user
thoroughly to ensure the product meets the particular requirements.
InlaySolution does not represent that this product is fit for any
particular purpose or use.
Impinji Monza 3
- EPCglobal and ISO 18000-6C compliant, assuring robust performance
and seamless interoperability.
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- Dual antenna input maximizes range and provides for orientation
indifference.
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- Superior interference rejection combined with outstanding
sensitivity yields excellent tag performance—even when buried deep
within a pallet of RF-absorbing material.
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- Write rate of >15 tags/second enables rapid programming
throughput.
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- Commercial temperature range (–40°C to +85°C) for reliable
performance under harsh conditions.
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- Patented interference rejection affords robust performance in noisy
environments.
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- Impinj’s field-rewritable NVM (optimized for RFID) with 96-bit EPC
provides programming flexibility and 100,000 cycle/50-year
retention reliability.
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- Available preprogramming of customer EPCs at the wafer level
delivers a fast, reliable, and cost-effective turnkey manufacturing
solution.
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Packing detalis below:
Qty/Roll (Actual Qty as per Shipping Mark)
12,800±300pcs/roll; 1roll/carton
Packaging
A. Use two lines of 25mm interleaf to protect IC and antenna.
B.Keep away from water, collision and static.
C. Delivery with the package of static-free bag.