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LCMXO2-1200HC-4TG144C General Purpose Relays Ic Fpga 107 I/O 144tqfp

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LCMXO2-1200HC-4TG144C General Purpose Relays Ic Fpga 107 I/O 144tqfp

Country/Region china
City & Province shenzhen guangdong
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Product Details

LCMXO2-1200HC-4TG144C General Purpose Relays Ic Fpga 107 I/O 144tqfp
 

MachXO2 Field Programmable Gate Array (FPGA) IC 107 65536 1280 144-LQFP

 

Specifications of  LCMXO2-1200HC-4TG144C

 

TYPEDESCRIPTION
CategoryIntegrated Circuits (ICs)
Embedded
FPGAs (Field Programmable Gate Array)
MfrLattice Semiconductor Corporation
SeriesMachXO2
PackageTray
Product StatusActive
Digi-Key ProgrammableNot Verified
Number of LABs/CLBs160
Number of Logic Elements/Cells1280
Total RAM Bits65536
Number of I/O107
Voltage - Supply2.375V ~ 3.465V
Mounting TypeSurface Mount
Operating Temperature0°C ~ 85°C (TJ)
Package / Case144-LQFP
Supplier Device Package144-TQFP (20x20)
Base Product NumberLCMXO2-1200

 

Features of LCMXO2-1200HC-4TG144C

 
 Flexible Logic Architecture
• Six devices with 256 to 6864 LUT4s and 18 to 334 I/Os
 Ultra Low Power Devices
• Advanced 65 nm low power process
• As low as 22 µW standby power
• Programmable low swing differential I/Os
• Stand-by mode and other power saving options
 Embedded and Distributed Memory
• Up to 240 kbits sysMEM™ Embedded Block RAM
• Up to 54 kbits Distributed RAM
• Dedicated FIFO control logic
 On-Chip User Flash Memory
• Up to 256 kbits of User Flash Memory
• 100,000 write cycles
• Accessible through WISHBONE, SPI, I2 C and JTAG interfaces
• Can be used as soft processor PROM or as Flash memory
 Pre-Engineered Source Synchronous I/O
• DDR registers in I/O cells
• Dedicated gearing logic
• 7:1 Gearing for Display I/Os
• Generic DDR, DDRX2, DDRX4
• Dedicated DDR/DDR2/LPDDR memory with DQS support
 High Performance, Flexible I/O Buffer
• Programmable sysIO™ buffer supports wide
range of interfaces:
– LVCMOS 3.3/2.5/1.8/1.5/1.2
– LVTTL
– PCI
– LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL
– SSTL 25/18
– HSTL 18
– Schmitt trigger inputs, up to 0.5 V hysteresis
• I/Os support hot socketing
• On-chip differential termination
• Programmable pull-up or pull-down mode
 Flexible On-Chip Clocking
• Eight primary clocks
• Up to two edge clocks for high-speed I/O interfaces (top and bottom sides only)
• Up to two analog PLLs per device with fractional-n frequency synthesis
– Wide input frequency range (7 MHz to 400 MHz)
 Non-volatile, Infinitely Reconfigurable
• Instant-on – powers up in microseconds
• Single-chip, secure solution
• Programmable through JTAG, SPI or I2 C
• Supports background programming of non-volatile memory
• Optional dual boot with external SPI memory
 TransFR™ Reconfiguration
• In-field logic update while system operates
 Enhanced System Level Support
• On-chip hardened functions: SPI, I2 C, timer/ counter
• On-chip oscillator with 5.5% accuracy
• Unique TraceID for system tracking
• One Time Programmable (OTP) mode
• Single power supply with extended operating range
• IEEE Standard 1149.1 boundary scan
• IEEE 1532 compliant in-system programming
 Broad Range of Package Options
• TQFP, WLCSP, ucBGA, csBGA, caBGA, ftBGA, fpBGA, QFN package options
• Small footprint package options
– As small as 2.5 mm x 2.5 mm
• Density migration supported
• Advanced halogen-free packaging
 
Slices of LCMXO2-1200HC-4TG144C
 
Slices 0-3 contain two LUT4s feeding two registers. Slices 0-2 can be configured as distributed memory. Table 2-1 shows the capability of the slices in PFU blocks along with the operation modes they enable. In addition, each PFU contains logic that allows the LUTs to be combined to perform functions such as LUT5, LUT6, LUT7 and LUT8. The control logic performs set/reset functions (programmable as synchronous/ asynchronous), clock select, chipselect and wider RAM/ROM functions.
 

Environmental & Export Classifications of LCMXO2-1200HC-4TG144C

 

ATTRIBUTEDESCRIPTION
RoHS StatusROHS3 Compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
REACH StatusREACH Unaffected
ECCNEAR99
HTSUS8542.39.0001
 

 

 

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