120-H High-performance acid brightening copper plating process
Applications and advantages
- Excellent brightening and leveling;
- Good covering, good leveling in LCD area, no pinhole and hard
spots;
- The bath solution is stable and easy to control;
- The plating layer has good flexility, low electrical resistivity,
so fits into the electrical machine industry which has high
requirements in physical property of the deposit.
- Could be implemented in various metal, such as iron, brass and zinc
alloy parts, as well as plastics.
- Has a good impurity tolerance and can be used for a long time,
activated carbon is needed under 800-1000 Ah/L quantity of
electricity.
Bath Composition and Working Conditions
| Bath composition and working conditions | Range | Standard |
|---|
| Cupric sulfate (CuSO4·5H2O) | 180-240g/L | 200g/L |
| Sulphuric acid (H2SO4) | 50-80g/L | 60g/L |
| Chloride ion (Cl-) | 60-120mg/L | 80mg/L |
| Make up solution 120-H Mu | 4-6ml/L | 5ml/L |
| Brightener 120-H A | 0.4-0.6ml/L | 0.5ml/L |
| Brightener 120-H B | 0.4-0.6ml/L | 0.5ml/L |
| Temperature | 16-30℃ | 20-28℃ |
| Cathode current density | 1-6A/dm2 | 3-5A/dm2 |
| Anode current density | 0.5-3 A/dm2 |
| Anode | Phosphorous copper anode (0.03-0.06% phosphorous) |
| Agitation | Air agitation or mechanical agitation |
Functions of additives
- Make up solution 120-H Mu: A lack of Make up solution 120-H Mu would lead to strips in high
and low current density areas in deposit. Too much 120-H Mu would
make deposit misty. Make up solution 120-H Mu contains proper
amount of Brightener 120-HB and wetting agent.
- Brightener 120-H A: A lack of Brightener 120-H A would decrease the leveling in whole
current density areas. Too much 120-H A would engender pinholes on
the layers. The low-current density area has poor leveling and has
patent boundary against the layer of other areas, but it remains
bright.
- Brightener 120-H B: A shortage of Brightener 120-H B would lead to burning in high
current density area of the deposit. Too much 120-H B would make
deposit misty and also lead to poor brightening in low-current
density area.
Preparation of bath solution
- Infuse half amount of deionized water into the bath (or spare
bath). The chloride ion content of the deionized water should be
below 70mg/L (ppm).
- Add the required amount of sulphuric acid very slowly. A large
amount of heat would generate. Stir strongly and add slowly to make
the temperature below 60℃ (Attention: be careful while adding sulphuric acid. Wear
protective clothes, gloves and eye shield to ensure safety).
- Add required amount of cupric sulfate, stir until it is dissolved.
- Add 2g/L activated carbon powder and stir for at least 1 hour.
- Use the filtration pump to filter the solution into a clean
electroplating bath. Add required amount of pure water.
- Cool the bath solution to 25℃.
- Find out the content of chlorine ion through analysis. Add proper
amount of hydrochloric acid or sodium chloride if needed to make
the content of chloride ion be within the standard range.
- Add proper amount of 120-H additives and stir.
- Electrolyze the bath solution for 2Ah/L. Then it could be put into
production.
Packing and Storage
Packed in 25kg plastic drums, stored in cool and dry place.
Product Display
Declaration:
The recommendations among the content of this instruction is based
on the trials and tests, as well as the related documents which are
credible to our company. As the operating practices and equipment
differ from each other, we will not hold responsible for any
negative outcomes. The content of this instruction could not serve
as evidence of copyright infringement.
