Shenzhen SUNSOM limited |
FOG/FOB Bonding M/C XCH91-H6
Application:
1. This machine is used for all kinds of FPC, COF, TAB and Liquid Crystal Screen PANEL(LCD PANEL), touch screen(TOUCH SCREEN), electronic ink display(EPD PANEL) and PCB multi station assembly.
2. Widely used in large and medium-sized LCD screen (LCD PANEL), touch screen(TOUCH PANEL), electronic ink display(EPD PANEL) for production and maintenance process(such as FOG, FOB, OLB, PWB bonding process).
Parameters:
Input Power: AC380V 50-60HZ
Rated Power: 15KW
Dimension: L3100*W1100*H2050mm
Program Control: PLC + Servo
Bonding Method: Cylinder + Servo Motor
Number of Working Stations: Double Stations
Available Size: 21 Inch (can be customized)
Controlling Unit: 7 inches Human Machine Interface
Alignment Mode: Manual Visual Alignment
Weight: 1200KG
Vacuum Process: Vacuum Inside
Connector: Rolling Automatically (settable)
Features:
1. In order to ensure the accuracy and stability, each bonding head can be adjusted independently.
2. Multiple X platform, double working stations can satisfy FOG, FOB, OLB and PWB bonding process.
3. Two working platform share same CCD group. It is enough for one person operate two working stations.
4. The group of motor drive head is adopted by servo motor and cylinder, to ensure that achieve no weight effect.
5. The distance between bonding head A and bonding head B can be adjusted independently. And the minimum gap can be5-10mm.
6. To achieve fast positioning, PCB plate is attached by vacuum.
7. The automatic connector can automatically roll, the frequency and the length can be set freely.
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